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NLV74HC595ADG

Onsemi

NLV74HC595ADG by Onsemi

NLV74HC595ADG by Onsemi is an 8-bit digital shift register with a supply voltage of 5V, operating b/w -55 to 125 °C. It features positive edge triggering, 3-state output, and a max frequency of 4MHz. Ideal for military-grade applications requiring high-speed data transfer in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,307 parts In-Stock

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Digiode

USA . 1,594 parts In-Stock

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Vigor

Singapore . 306 parts In-Stock

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$0.450

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AZTECH Wire

Italy . 256 parts In-Stock

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$14.260

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Component Stockers USA

USA . 285 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 8,389 parts In-Stock

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Problanco Electronics

Mexico . 4,383 parts In-Stock

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Corphita

USA . 2,113 parts In-Stock

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Kulean Microsystems

USA . 2,081 parts In-Stock

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TANS Electronics

Latvia . 1,835 parts In-Stock

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Corohmni

South Africa . 480 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 202 parts In-Stock

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Overview

Experience the innovation and reliability of Onsemi with the NLV74HC595ADG digital shift register. Designed for high-performance applications, this product offers seamless integration and superior functionality. Perfect for a wide range of industries, from automotive to industrial automation, this shift register delivers unparalleled value and efficiency. Trust Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and increasing production efficiency.

No. of Bits: 8

Having 8 bits provides sufficient data storage capacity, making the shift register suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes the shift register compatible with standard electronic systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the shift register can withstand harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-STATE output allows for three output states - high impedance, low, and high, providing flexibility in interfacing with other components.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the overall performance of the shift register.

Maximum Frequency At Nominal Supply: 4000000 Hz

The high maximum frequency allows for fast data transfer and efficient operation in high-speed applications.

Technical Specifications

Digital Shift Registers NLV74HC595ADG attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

NLV74HC595ADG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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