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CD74HC165MTG4

Texas Instruments

CD74HC165MTG4 by Texas Instruments

CD74HC165MTG4 by Texas Instruments is an 8-bit digital shift register with a propagation delay of 250 ns. It operates at a nominal voltage of 4.5V and has a max frequency of 20 MHz. Ideal for military-grade applications requiring fast data transfer in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,095 parts In-Stock

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Vyrian

USA . 1,958 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 270 parts In-Stock

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$6.788

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$6.788

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Parana Technologies

USA . 1,050 parts In-Stock

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$17.752

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$17.934

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$17.752

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DigiPath Technology Company

USA . 1,200 parts In-Stock

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$19.547

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$19.547

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ChromeModa Solutions

Germany . 6,801 parts In-Stock

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$19.946

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$16.356

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$19.946

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IDEA Electronic Components Group

UK . 2,010 parts In-Stock

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$19.946

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$18.949

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$17.951

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One Stop Electronics

USA . 1,044 parts In-Stock

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$33.000

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Ampacity Inc.

Singapore . 969 parts In-Stock

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$50.000

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Argo Parts USA

USA . 4,423 parts In-Stock

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Corphita

USA . 2,229 parts In-Stock

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Continental Prestige Electronics

USA . 365 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Upgrade your digital shift register experience with the high-quality CD74HC165MTG4 by Texas Instruments. Made from durable PLASTIC/EPOXY material, this rectangular package features 8 bits and a propagation delay of just 250 ns, ensuring fast and efficient operation. Perfect for military-grade applications, this small outline package offers a wide temperature range from -55 to 125°C. With a maximum frequency of 20 MHz and a variety of advanced features, the CD74HC165MTG4 provides exceptional value and performance for all your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy material makes this product lightweight and durable, suitable for various applications.

No. of Bits: 8

Having 8 bits provides sufficient storage capacity for data processing, making it versatile for different tasks.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V makes this shift register energy-efficient and compatible with standard power sources.

Propagation Delay (tpd): 250 ns

With a low propagation delay of 250ns, this shift register enables fast and efficient data transfer within the system.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in harsh environmental conditions.

Maximum Frequency At Nominal Supply: 20000000 Hz

Capable of operating at a maximum frequency of 20MHz, this shift register supports high-speed data processing and real-time applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making this shift register efficient and reliable.

Technical Specifications

Digital Shift Registers CD74HC165MTG4 attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

SISO OPERATION ALSO AVAILABLE

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Register

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

24 MHz

Trade Compliance

CD74HC165MTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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