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HCF4021BM1

STMicroelectronics

HCF4021BM1 by STMicroelectronics

HCF4021BM1 by STMicroelectronics is an 8-bit digital shift register with a supply voltage of 5V. It has a propagation delay of 320ns and operates in temperatures ranging from -55 to 125°C. Ideal for military-grade applications, it features positive edge triggering and a max frequency of 8.5MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 7,959 parts In-Stock

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Anansix

USA . 2,520 parts In-Stock

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Digiode

USA . 2,367 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

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AZTECH Wire

Italy . 440 parts In-Stock

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$12.744

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440

$12.744

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IDEA Electronic Components Group

UK . 189 parts In-Stock

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$15.067

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$13.560

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MKK Technologies

India . 1,784 parts In-Stock

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$28.332

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$28.332

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DigiPath Technology Company

USA . 1,784 parts In-Stock

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$28.332

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$28.332

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Ampacity Inc.

Singapore . 1,223 parts In-Stock

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$44.000

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Component Stockers USA

USA . 482 parts In-Stock

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$99.990

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Lixinc

USA . 10,739 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,349 parts In-Stock

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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Microchip USA

USA . 5,424 parts In-Stock

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Argo Parts USA

USA . 2,834 parts In-Stock

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Corphita

USA . 2,342 parts In-Stock

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Parana Technologies

USA . 780 parts In-Stock

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$18.015

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Continental Prestige Electronics

USA . 703 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Kepictronics

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Overview

Discover the superior quality and reliability of the HCF4021BM1 by STMicroelectronics, a leading manufacturer in digital shift registers. Ideal for a wide range of applications, this innovative product offers customers unparalleled value with its advanced features and benefits. With a compact design and fast propagation delay, this versatile component is perfect for precise data shifting operations. Trust STMicroelectronics to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the HCF4021BM1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable applications.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on printed circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space, making it suitable for compact designs.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data processing tasks effectively, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with common power sources, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF helps reduce power consumption and improve signal transmission efficiency.

Power Supplies (V): 3/15

The availability of multiple power supply options makes this product flexible and adaptable to different operating conditions.

No. of Terminals: 16

With 16 terminals, this product provides ample connectivity options, allowing for versatile and complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is space-saving, making this product suitable for applications where board real estate is limited.

Propagation Delay (tpd): 320 ns

The low propagation delay of 320 ns ensures fast data processing and response times, making it suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance in harsh environmental conditions.

Trigger Type: POSITIVE EDGE

The positive edge trigger type allows for precise and synchronized data transfer, ensuring accurate timing in digital systems.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C enables this product to function effectively in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position offers increased stability and connectivity for secure and reliable operation.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75 mm allows for low-profile installations in space-constrained applications.

Width: 3.9 mm

The narrow width of 3.9 mm enables efficient use of board space, ideal for densely populated PCB layouts.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission, reducing the risk of data errors in digital systems.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage of 3V allows for energy-efficient operation and compatibility with a wide range of power sources.

Length: 9.9 mm

The compact length of 9.9 mm makes this product suitable for small form factor designs and applications with limited space.

Temperature Grade: MILITARY

The military-grade temperature grade ensures reliable performance in harsh environmental conditions, making it suitable for rugged applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and fast switching speeds, making it ideal for digital applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure mounting and easy soldering, enhancing the product's reliability and durability.

Terminal Pitch: 1.27 mm

The standard 1.27 mm terminal pitch allows for easy integration with other components on the PCB, ensuring compatibility with common manufacturing processes.

Count Direction: RIGHT

The count direction set to right ensures compatibility and seamless integration with other digital components within the system.

Minimum fmax: 8.5 MHz

The high minimum fmax of 8.5 MHz enables this product to handle high-frequency data processing tasks effectively, making it suitable for high-speed applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this product has moderate sensitivity to moisture, ensuring reliable performance in typical operating conditions.

Maximum Supply Voltage (Vsup): 20 V

The high maximum supply voltage of 20V provides flexibility and robustness, allowing for operation in varying voltage conditions.

Technical Specifications

Digital Shift Registers HCF4021BM1 attributes and parameters. Explore more Digital Shift Registers devices from STMicroelectronics

Specs

Additional Features:

OUTPUTS ALSO AVAILABLE AT 6TH AND 7TH STAGE OF THE SHIFT REGISTER

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/15

Propagation Delay (tpd):

320 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

8.5 MHz

Trade Compliance

HCF4021BM1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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