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HCF40104BF

STMicroelectronics

HCF40104BF by STMicroelectronics

HCF40104BF by STMicroelectronics is a 4-bit digital shift register with CMOS technology. It operates at temperatures ranging from -40 to 85 °C and supports power supplies of 3-15V. With a max frequency of 3MHz, it is ideal for industrial applications requiring bidirectional count direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,768 parts In-Stock

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2,768

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Digiode

USA . 2,291 parts In-Stock

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2,291

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Vyrian

USA . 826 parts In-Stock

1+ parts

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826

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 180 parts In-Stock

1+ parts

$1.140

100+ parts

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180

$1.140

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Northwest PG Solutions

USA . 1,092 parts In-Stock

1+ parts

$1.254

100+ parts

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1,092

$1.254

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IDEA Electronic Components Group

UK . 909 parts In-Stock

1+ parts

$25.453

100+ parts

-

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$22.907

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909

$25.453

-

$22.907

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MKK Technologies

India . 218 parts In-Stock

1+ parts

$47.862

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218

$47.862

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DigiPath Technology Company

USA . 218 parts In-Stock

1+ parts

$47.862

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218

$47.862

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Parana Technologies

USA . 1,137 parts In-Stock

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$30.433

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1,137

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$30.433

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Corphita

USA . 468 parts In-Stock

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468

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Overview

Unlock the power of digital shift registers with the HCF40104BF by STMicroelectronics. Crafted with precision and expertise, this product boasts unparalleled quality and reliability. Ideal for a wide range of applications, this versatile component offers seamless integration and exceptional performance. Experience the value and benefits of STMicroelectronics' cutting-edge technology with the HCF40104BF, designed to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable and reliable material, providing protection for the internal components of the shift register. It also ensures good thermal conductivity.

No. of Bits: 4

Having 4 bits allows for a decent range of data storage and manipulation capabilities, making this shift register suitable for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this shift register can withstand harsh environments and extended usage without overheating.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology ensures low power consumption and high noise immunity, making this shift register efficient and reliable.

Maximum Frequency At Nominal Supply: 3000000 Hz

High maximum frequency allows for fast data processing and output, making this shift register suitable for applications that require quick response times.

Technical Specifications

Digital Shift Registers HCF40104BF attributes and parameters. Explore more Digital Shift Registers devices from STMicroelectronics

Specs

Count Direction:

BIDIRECTIONAL

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Maximum Frequency At Nominal Supply:

3000000 Hz

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/15

Qualification:

Not Qualified

Sub-Category:

Shift Registers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HCF40104BF Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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