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CD74HC166MG4

Texas Instruments

CD74HC166MG4 by Texas Instruments

CD74HC166MG4 by Texas Instruments is an 8-bit digital shift register with a propagation delay of 32ns. It operates at a nominal voltage of 4.5V and has a max frequency of 20MHz. Ideal for applications requiring fast data transfer, such as in military-grade electronics due to its temperature range from -55°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 6,752 parts In-Stock

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Digiode

USA . 4,029 parts In-Stock

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Resion

USA . 426 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 200 parts In-Stock

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Holdelec - ElecDif-Pro

France . 200 parts In-Stock

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Nova Conductors

Japan . 47 parts In-Stock

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Parana Technologies

USA . 2,001 parts In-Stock

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$12.751

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$13.215

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ChromeModa Solutions

Germany . 5,574 parts In-Stock

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$14.327

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$11.748

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IDEA Electronic Components Group

UK . 1,588 parts In-Stock

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$14.327

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$13.611

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$12.894

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AZTECH Wire

Italy . 488 parts In-Stock

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$18.700

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Ampacity Inc.

Singapore . 1,481 parts In-Stock

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$37.000

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One Stop Electronics

USA . 292 parts In-Stock

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Argo Parts USA

USA . 3,316 parts In-Stock

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Continental Prestige Electronics

USA . 2,356 parts In-Stock

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Microchip USA

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Corphita

USA . 1,069 parts In-Stock

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DigiPath Technology Company

USA . 916 parts In-Stock

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$12.917

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Enhance your digital designs with the Texas Instruments CD74HC166MG4 digital shift register. Crafted with precision and quality, this product boasts a multitude of applications in various industries. With Texas Instruments' reputation for excellence, you can trust in the reliability and performance of this component. Experience faster data transfer, efficient signal processing, and seamless integration into your projects. Elevate your creations with the CD74HC166MG4 and unlock a world of possibilities in digital design.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 32 ns

Low propagation delay ensures quick response time and efficient data transfer.

No. of Bits: 8

Provides sufficient number of bits for various digital processing applications.

Nominal Supply Voltage / Vsup (V): 4.5

Ideal supply voltage for stable operation and compatibility with various systems.

Maximum I (ol): 5.2 Amp

High output current capability allows for driving external loads without additional amplification.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures accurate data capture and synchronization.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable operation.

Maximum Frequency At Nominal Supply: 20,000,000 Hz

High maximum frequency allows for fast data processing and efficient operation.

Technical Specifications

Digital Shift Registers CD74HC166MG4 attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

SISO OPERATION ALSO AVAILABLE

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

32 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

23 MHz

Trade Compliance

CD74HC166MG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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