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HCF4006BC1

STMicroelectronics

HCF4006BC1 by STMicroelectronics

HCF4006BC1 by STMicroelectronics is a digital shift register with 4 functions, 5 bits, and operates at a supply voltage of 3-15V. It is used in industrial applications for data shifting and control signal processing. The chip carrier package style with matte tin finish makes it suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,394 parts In-Stock

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2,394

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Anansix

USA . 1,272 parts In-Stock

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1,272

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Digiode

USA . 785 parts In-Stock

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785

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 209 parts In-Stock

1+ parts

$30.087

100+ parts

-

1k+ parts

$27.078

10k+ parts

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209

$30.087

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$27.078

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MKK Technologies

India . 448 parts In-Stock

1+ parts

$56.576

100+ parts

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448

$56.576

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DigiPath Technology Company

USA . 448 parts In-Stock

1+ parts

$56.576

100+ parts

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448

$56.576

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Corphita

USA . 3,691 parts In-Stock

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3,691

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Native Components

USA . 957 parts In-Stock

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957

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Parana Technologies

USA . 393 parts In-Stock

1+ parts

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100+ parts

$35.973

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393

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$35.973

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Northwest PG Solutions

USA . 382 parts In-Stock

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382

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Overview

Unleash the power of innovation with the HCF4006BC1 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and reliability in their digital shift registers. Perfect for a wide range of applications, this product offers customers unmatched value, benefits, and advantages. Elevate your projects to new heights with the HCF4006BC1 and experience seamless performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and cost-effective, making this product a good choice for applications where reliability and affordability are key factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on printed circuit boards, saving time and space in electronic devices.

No. of Functions: 4

With 4 functions in one unit, this product offers versatility and efficiency in digital shifting operations.

Package Shape: SQUARE

The square package shape provides a compact design, allowing for dense packing of components on a PCB.

No. of Bits: 5

Five bits of data storage capacity provide sufficient range for many digital applications, making this product suitable for a variety of systems.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common standard in many electronic systems, ensuring compatibility and ease of integration.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance allows for stable and reliable performance in high-speed digital signal processing applications.

Power Supplies (V): 3/15

Support for a range of power supplies from 3V to 15V provides flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and enables the device to interface with a variety of external components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers robust protection for the internal components and facilitates easy handling during assembly.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product is suitable for use in industrial environments where elevated temperatures may be present.

Trigger Type: NEGATIVE EDGE

The negative edge trigger type ensures precise control over the shifting of data, making this product ideal for applications requiring accurate timing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows this product to function reliably in extreme cold conditions, expanding its range of potential applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability and ease of assembly.

Terminal Position: QUAD

The quad terminal position offers multiple connection points, enabling efficient routing of signals and power within the system.

Maximum Seated Height: 4.57 mm

With a low maximum seated height, this product is suitable for space-constrained applications where compactness is a key requirement.

Width: 8.9662 mm

The compact width of 8.9662 mm allows for efficient use of PCB real estate and facilitates dense packing of components in electronic devices.

Output Polarity: TRUE

The true output polarity ensures compatibility with standard logic levels, making integration with other digital components straightforward and reliable.

Minimum Supply Voltage (Vsup): 3 V

Support for a minimum supply voltage of 3V ensures flexibility in power source selection and compatibility with low-voltage systems.

Length: 8.9662 mm

The length of 8.9662 mm contributes to the compact and space-efficient design of this product, making it ideal for applications with size constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making this product suitable for demanding applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making this product energy-efficient and versatile.

Terminal Form: J BEND

The J bend terminal form provides mechanical stability and secure attachment during PCB assembly, ensuring reliable connectivity in the system.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and efficient routing of signals on the PCB, enabling high-density mounting of components.

Count Direction: RIGHT

The right count direction ensures compatibility with standard digital systems and facilitates seamless integration with other components in the circuit.

Maximum Supply Voltage (Vsup): 15 V

Support for a maximum supply voltage of 15V provides flexibility in power source selection and allows for operation in systems with higher voltage requirements.

Technical Specifications

Digital Shift Registers HCF4006BC1 attributes and parameters. Explore more Digital Shift Registers devices from STMicroelectronics

Specs

Additional Features:

SHARED CLOCK BETWEEN 4 SHIFT REGISTERS; TWO 4 BIT & TWO 5 BIT SHIFT REGISTERS

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.9662 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

5

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3/15

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

NEGATIVE EDGE

Width:

8.9662 mm

Trade Compliance

HCF4006BC1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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