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HCF4006M013TR

STMicroelectronics

HCF4006M013TR by STMicroelectronics

HCF4006M013TR by STMicroelectronics is a digital shift register with 4 functions, 5 bits, and operates at a supply voltage of 5V. It is used in military-grade applications due to its CMOS technology, negative edge trigger type, and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,897 parts In-Stock

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2,897

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Digiode

USA . 1,883 parts In-Stock

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1,883

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Vyrian

USA . 619 parts In-Stock

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619

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 465 parts In-Stock

1+ parts

$12.748

100+ parts

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$11.474

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465

$12.748

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$11.474

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MKK Technologies

India . 1,563 parts In-Stock

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$23.973

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1,563

$23.973

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DigiPath Technology Company

USA . 1,563 parts In-Stock

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$23.973

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1,563

$23.973

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Corphita

USA . 2,143 parts In-Stock

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Northwest PG Solutions

USA . 1,600 parts In-Stock

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1,600

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Parana Technologies

USA . 307 parts In-Stock

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$15.243

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307

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Native Components

USA . 148 parts In-Stock

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Overview

Discover the innovative HCF4006M013TR by STMicroelectronics, a top-quality digital shift register that offers unparalleled performance and reliability. With its advanced technology and military-grade temperature grade, this product is perfect for a wide range of applications. From industrial automation to consumer electronics, the HCF4006M013TR provides customers with exceptional value, efficiency, and precision. Trust in STMicroelectronics, a renowned manufacturer, to deliver cutting-edge solutions that meet your needs and exceed your expectations. Experience the difference with the HCF4006M013TR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and increasing efficiency.

No. of Functions: 4

Provides versatility and flexibility in use, allowing for multiple functions to be performed simultaneously.

Package Shape: RECTANGULAR

Optimal shape for fitting into standard electronic circuits and components.

No. of Bits: 5

Offers a moderate level of data storage capability, suitable for a range of applications.

Nominal Supply Voltage / Vsup (V): 5

Common voltage level that can be easily sourced and compatible with many electronic systems.

Load Capacitance (CL): 50 pF

Helps in stabilizing the device's performance, particularly in high-frequency applications.

Power Supplies (V): 5/15

Provides flexibility in power input options, accommodating different system requirements.

No. of Terminals: 14

Sufficient terminals for connecting to other components and devices in a circuit.

Package Style (Meter): SMALL OUTLINE

Compact design that saves space on PCBs and allows for efficient use of board real estate.

Maximum Operating Temperature: 125 °C

Wide temperature range allows for operation in various environmental conditions.

Trigger Type: NEGATIVE EDGE

Precise triggering mechanism for accurate data transfer and processing.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold conditions, expanding its range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable finish that resists corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Provides multiple connection points for enhanced stability and performance.

Maximum Seated Height: 1.75 mm

Low profile design suitable for compact electronic assemblies.

Width: 3.9 mm

Narrow width that allows for efficient placement on PCBs with limited space.

Output Polarity: TRUE

Consistent output polarity for reliable data transmission and processing.

Minimum Supply Voltage (Vsup): 3 V

Low minimum voltage requirement for compatibility with a range of power sources.

Length: 8.65 mm

Compact length ideal for space-constrained electronic designs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and ease of soldering during assembly.

Packing Method: TR

TR packaging method ensures safe transportation and handling of the product.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with various PCB layouts and designs.

Count Direction: RIGHT

Specific count direction for streamlined operation and data processing.

Maximum Supply Voltage (Vsup): 20 V

High maximum supply voltage capability for versatile power input options.

Technical Specifications

Digital Shift Registers HCF4006M013TR attributes and parameters. Explore more Digital Shift Registers devices from STMicroelectronics

Specs

Additional Features:

SHARED CLOCK BETWEEN 4 SHIFT REGISTERS; TWO 4 BIT & TWO 5 BIT SHIFT REGISTERS

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

5

No. of Functions:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

NEGATIVE EDGE

Width:

3.9 mm

Trade Compliance

HCF4006M013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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