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HCF4014BEY

STMicroelectronics

HCF4014BEY by STMicroelectronics

HCF4014BEY by STMicroelectronics is an 8-bit digital shift register with a propagation delay of 320 ns. It operates at a supply voltage range of 3-15V and has a max frequency of 8.5 MHz. Ideal for military-grade applications requiring true output polarity and positive edge trigger type in a compact rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 8,812 parts In-Stock

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Anansix

USA . 2,359 parts In-Stock

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Digiode

USA . 1,630 parts In-Stock

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ECAB

Sweden . 920 parts In-Stock

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J2 Sourcing AB

Sweden . 836 parts In-Stock

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Ashlea Components Ltd

UK . 50 parts In-Stock

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Zilex Electronics Inc.

Canada . 15 parts In-Stock

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Native Components

USA . 34 parts In-Stock

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$1.207

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Northwest PG Solutions

USA . 2,106 parts In-Stock

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$1.328

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Microchip USA

USA . 401 parts In-Stock

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$14.222

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AZTECH Wire

Italy . 172 parts In-Stock

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$15.900

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Advanced Electronics

New Zealand . 32 parts In-Stock

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$21.221

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$19.311

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$17.401

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IDEA Electronic Components Group

UK . 1,427 parts In-Stock

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$25.884

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MKK Technologies

India . 221 parts In-Stock

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$48.674

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DigiPath Technology Company

USA . 221 parts In-Stock

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Perfect Parts

USA . 2,124 parts In-Stock

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Parana Technologies

USA . 1,590 parts In-Stock

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Assy Fe

Spain . 1,372 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 948 parts In-Stock

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Corphita

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Overview

Unlock the potential of your electronic projects with the HCF4014BEY digital shift register by STMicroelectronics. Designed with precision and quality in mind, this component offers seamless integration and reliable performance. Ideal for a wide range of applications, this shift register is a versatile solution that provides exceptional value to customers. Experience the benefits of efficiency, accuracy, and innovation with the HCF4014BEY, setting new standards in digital technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the shift register, making it suitable for various applications.

No. of Bits: 8

8 bits allow for a wide range of data processing and control capabilities.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures reliable operation of the shift register.

Propagation Delay (tpd): 320 ns

Low propagation delay enables quick data transfer within the shift register, contributing to efficient performance.

Temperature Grade: MILITARY

Military-grade temperature rating ensures the shift register can operate in harsh environments with extreme temperature conditions.

Minimum fmax: 8.5 MHz

High maximum frequency allows for fast data processing, making the shift register suitable for applications requiring high-speed operation.

Technical Specifications

Digital Shift Registers HCF4014BEY attributes and parameters. Explore more Digital Shift Registers devices from STMicroelectronics

Specs

Additional Features:

OUTPUTS ALSO AVAILABLE AT 6TH AND 7TH STAGE OF THE SHIFT REGISTER

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/15

Propagation Delay (tpd):

320 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

8.5 MHz

Trade Compliance

HCF4014BEY Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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