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NLV74HC595AMN1TWG

Onsemi

NLV74HC595AMN1TWG by Onsemi

NLV74HC595AMN1TWG by Onsemi is an 8-bit digital shift register with a supply voltage of 2-6V. It operates b/w -55 to 125 °C, featuring positive edge triggering and 3-state outputs. Ideal for military-grade applications requiring compact design and high-temperature tolerance.

Median Price

$0.408

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 18,000 parts In-Stock

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$0.415

10k+ parts

$0.370

18,000

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$0.415

$0.370

Rochester

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$0.400

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$0.332

10k+ parts

$0.296

18,000

-

$0.400

$0.332

$0.296

Distributors (In-Stock)

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Flip Electronics

USA . 18,000 parts In-Stock

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Digiode

USA . 791 parts In-Stock

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Vyrian

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80

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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Microchip USA

USA . 12,544 parts In-Stock

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Kulean Microsystems

USA . 8,317 parts In-Stock

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Problanco Electronics

Mexico . 8,224 parts In-Stock

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TANS Electronics

Latvia . 6,284 parts In-Stock

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SupplyDigital Components

Austria . 820 parts In-Stock

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Corphita

USA . 648 parts In-Stock

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UHIMA Technologies

Türkiye . 251 parts In-Stock

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Corohmni

South Africa . 148 parts In-Stock

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Overview

Enhance your electronic projects with the NLV74HC595AMN1TWG by Onsemi, a top-quality digital shift register that offers unmatched performance and reliability. Manufactured by Onsemi, a trusted industry leader, this chip boasts AEC-Q100 screening level for automotive applications. With its 8-bit design, true output polarity, and positive edge trigger type, this chip delivers precise results every time. Whether you're working on automotive electronics, industrial automation, or consumer devices, this versatile chip provides the perfect solution with its 3-state output characteristics and wide operating temperature range. Upgrade your projects today with the NLV74HC595AMN1TWG and experience the difference in quality and performance.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly, making this digital shift register a convenient choice for manufacturers.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality, making this product suitable for automotive applications.

No. of Bits: 8

With 8 bits, this shift register offers sufficient data storage capacity for various digital applications.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal voltage of 3V, this shift register is energy-efficient and suitable for low power applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this shift register can withstand harsh environmental conditions and ensure consistent performance.

Output Characteristics: 3-STATE

The 3-STATE output feature allows multiple shift registers to be connected to a common data bus, providing flexibility and versatility in digital designs.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making this shift register a reliable choice for various applications.

Technical Specifications

Digital Shift Registers NLV74HC595AMN1TWG attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-XQCC-N16

JESD-609 Code:

e3

Length:

3.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

2.5 mm

Trade Compliance

NLV74HC595AMN1TWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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