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NLV74HC164BDTR2G

Onsemi

NLV74HC164BDTR2G by Onsemi

NLV74HC164BDTR2G by Onsemi is an 8-bit digital shift register with positive edge trigger. Operating b/w -55 to 125 °C, it has a supply voltage range of 2-6 V. Ideal for military applications, this CMOS technology device comes in a small outline package with dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,636 parts In-Stock

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Digiode

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Kulean Microsystems

USA . 2,518 parts In-Stock

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TANS Electronics

Latvia . 2,475 parts In-Stock

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SupplyDigital Components

Austria . 1,884 parts In-Stock

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Corphita

USA . 415 parts In-Stock

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UHIMA Technologies

Türkiye . 303 parts In-Stock

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Problanco Electronics

Mexico . 276 parts In-Stock

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Corohmni

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Overview

Enhance your digital designs with the NLV74HC164BDTR2G by Onsemi, a top-tier manufacturer known for its high-quality components. This digital shift register offers superior performance and reliability, making it ideal for a wide range of applications. From automotive to industrial automation, this product delivers exceptional value and benefits to customers looking for efficient and effective solutions. Upgrade your projects with the NLV74HC164BDTR2G and experience the advantages of premium quality technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the shift register, ensuring reliability in various operating conditions.

Surface Mount: YES

Being surface mountable makes installation of the shift register easier and more efficient, saving space on the PCB.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and quality standards, making this shift register suitable for automotive applications where performance is critical.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V allows for compatibility with a wide range of electronic systems, making it versatile for various applications.

No. of Terminals: 14

Having 14 terminals provides flexibility in connectivity options, allowing for easy integration into existing circuit designs.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this shift register can withstand high temperature environments, making it suitable for industrial and automotive applications.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures accurate and reliable data transfer within the shift register, reducing the risk of errors in data transmission.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the shift register in various electronic systems.

Technical Specifications

Digital Shift Registers NLV74HC164BDTR2G attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

NLV74HC164BDTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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