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NLV74HC595ANG

Onsemi

NLV74HC595ANG by Onsemi

NLV74HC595ANG by Onsemi is an 8-bit digital shift register with a supply voltage of 5V, operating b/w -55 to 125 °C. It features a positive edge trigger, 3-state output, and supports a max frequency of 4MHz. Ideal for military-grade applications requiring high-speed data transfer in compact spaces.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

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Digiode

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TANS Electronics

Latvia . 6,173 parts In-Stock

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Problanco Electronics

Mexico . 5,296 parts In-Stock

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Kulean Microsystems

USA . 3,487 parts In-Stock

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Corphita

USA . 1,300 parts In-Stock

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SupplyDigital Components

Austria . 1,075 parts In-Stock

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UHIMA Technologies

Türkiye . 647 parts In-Stock

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Corohmni

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Overview

Enhance your digital shift register applications with the NLV74HC595ANG by Onsemi. This high-quality product offers reliability and efficiency, thanks to its manufacturer's reputation for excellence. With 8 bits and a positive edge trigger type, this IC provides seamless operation at a wide temperature range. Its true output polarity and 3-state characteristics make it ideal for various projects. Trust Onsemi to deliver top-notch components like the NLV74HC595ANG for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making it suitable for automotive applications.

No. of Bits: 8

8-bit shift registers provide sufficient data storage capacity for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at the standard 5V supply voltage ensures compatibility with most systems and components.

Power Supplies (V): 2/6

Support for power supplies ranging from 2V to 6V provides flexibility in different operating conditions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the shift registers can withstand harsh environmental conditions.

Output Characteristics: 3-STATE

3-state outputs allow for high impedance, enhancing flexibility in circuit design and data transmission.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures accurate data capture and synchronization in sequential operations.

Minimum Operating Temperature: -55 °C

The wide temperature range makes the shift registers suitable for both extreme hot and cold environments.

Maximum Frequency At Nominal Supply: 4000000 Hz

High-frequency operation at 4 MHz enables rapid data processing and transmission.

Technical Specifications

Digital Shift Registers NLV74HC595ANG attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4000000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

4.44 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

NLV74HC595ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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