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NLV74HC14ADTG

Onsemi

NLV74HC14ADTG by Onsemi

NLV74HC14ADTG by Onsemi is a CMOS Logic Gates IC with 6 functions, 22ns propagation delay at 5V. AEC-Q100 screened for automotive applications, it has Schmitt Trigger feature and operates b/w -55 to 125 °C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 11,677 parts In-Stock

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Digiode

USA . 1,961 parts In-Stock

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Vigor

Singapore . 263 parts In-Stock

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AZTECH Wire

Italy . 954 parts In-Stock

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954

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TANS Electronics

Latvia . 7,917 parts In-Stock

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SupplyDigital Components

Austria . 6,741 parts In-Stock

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Problanco Electronics

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Corphita

USA . 2,137 parts In-Stock

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Kulean Microsystems

USA . 1,975 parts In-Stock

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UHIMA Technologies

Türkiye . 494 parts In-Stock

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Microchip USA

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Corohmni

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Overview

Enhance your electronic projects with the NLV74HC14ADTG logic gates from Onsemi, a trusted manufacturer known for delivering high-quality components. These logic gates are versatile and reliable, offering customers seamless integration and exceptional performance. With a wide range of applications in various industries, the NLV74HC14ADTG provides value and benefits, making it a must-have for any project that requires precision and efficiency. Upgrade your designs today with Onsemi's NLV74HC14ADTG logic gates.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the components inside the logic gates, making them suitable for various operating conditions.

Propagation Delay At Nominal Supply: 22 ns

The fast propagation delay allows for quick signal processing, making these logic gates ideal for applications that require rapid response times.

Surface Mount: YES

Surface mount capability makes installation easier and more convenient, saving time and effort during assembly.

No. of Functions: 6

Having multiple functions in a single component can help streamline circuit design and save space on the PCB.

Screening Level: AEC-Q100

Meeting AEC-Q100 standards ensures high reliability and performance under harsh environmental conditions, making these logic gates suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes integration with other components in the system more convenient and cost-effective.

Load Capacitance (CL): 50 pF

The specified load capacitance indicates the maximum load the logic gates can drive efficiently, ensuring reliable operation within specified parameters.

Power Supplies (V): 2/6

Support for dual power supplies provides flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 14

Having a sufficient number of terminals allows for easy connectivity and ensures compatibility with standard PCB layouts.

Maximum I (ol): 4 Amp

The high output current capability allows these logic gates to drive multiple loads without external amplification, simplifying the circuit design.

Propagation Delay (tpd): 110 ns

Although not the fastest, the specified propagation delay still offers a good balance between speed and power consumption for various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, these logic gates can withstand elevated temperatures without compromising performance or reliability.

Minimum Operating Temperature: -55 °C

The wide temperature range ensures reliable operation in extreme cold conditions, making these logic gates suitable for diverse environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and allow for easy routing of signal traces, enhancing overall system design.

Maximum Seated Height: 1.2 mm

The low profile design with a maximum seated height of 1.2 mm saves space and allows for compact system integration.

Width: 4.4 mm

The narrow width of 4.4 mm facilitates high-density PCB designs and allows for efficient use of space on the board.

Minimum Supply Voltage (Vsup): 2 V

Support for low supply voltage operation enables energy-efficient designs and extends battery life in portable or low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering and joint reliability during assembly, reducing the risk of component failure.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures robust solder joints and reliable performance in manufacturing processes.

Length: 5 mm

The compact length of 5 mm contributes to the overall small form factor of the logic gates, allowing for space-efficient PCB layouts.

Temperature Grade: MILITARY

Meeting military-grade standards ensures ruggedness and reliability in harsh environments, making these logic gates suitable for demanding applications.

Schmitt Trigger: YES

The presence of a Schmitt trigger helps eliminate noise and improve signal integrity, making these logic gates ideal for noise-sensitive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates energy-efficient and reliable in various operating conditions.

Terminal Form: GULL WING

The Gull Wing terminal form facilitates automated assembly processes and ensures secure solder joints for reliable electrical connections.

Packing Method: RAIL

The rail packing method simplifies handling, storage, and transportation of these logic gates during manufacturing and assembly processes.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65 mm allows for high-density mounting on the PCB, maximizing board space utilization and enabling compact designs.

Maximum Supply Voltage (Vsup): 6 V

Support for a maximum supply voltage of 6V ensures compatibility with a wide range of power sources and voltage levels in different applications.

Technical Specifications

Logic Gates NLV74HC14ADTG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74HC14ADTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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