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NLV74HC02ADTR2G

Onsemi

NLV74HC02ADTR2G by Onsemi

NLV74HC02ADTR2G by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 22ns propagation delay at 5V. Suitable for military applications due to AEC-Q100 screening level and operating temperature range of -55 to 125 °C. Package style is small outline, thin profile, shrink pitch for compact designs.

Median Price

$0.165

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 35,000 parts In-Stock

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Verical

USA . 35,000 parts In-Stock

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$0.147

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$0.139

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$0.139

Rochester

USA . 1,151 parts In-Stock

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$0.182

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$0.151

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$0.135

1,151

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$0.182

$0.151

$0.135

Distributors (In-Stock)

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Digiode

USA . 1,613 parts In-Stock

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$0.142

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Vyrian

USA . 6,914 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,562 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,387 parts In-Stock

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$0.134

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2,387

$0.134

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Corohmni

South Africa . 231 parts In-Stock

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$0.147

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Component Stockers USA

USA . 97,830 parts In-Stock

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$0.150

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$0.140

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$0.130

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$0.130

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$0.130

Vigor

Singapore . 321 parts In-Stock

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$0.180

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321

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AZTECH Wire

Italy . 564 parts In-Stock

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$12.760

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564

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Continental Prestige Electronics

USA . 73,033 parts In-Stock

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SupplyDigital Components

Austria . 8,309 parts In-Stock

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Kulean Microsystems

USA . 5,335 parts In-Stock

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Problanco Electronics

Mexico . 3,262 parts In-Stock

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TANS Electronics

Latvia . 1,254 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 19 parts In-Stock

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Overview

Built by the reputable manufacturer Onsemi, the NLV74HC02ADTR2G logic gates offer unmatched quality and reliability for a wide range of applications. With a fast propagation delay and low power consumption, this product provides exceptional value and performance to customers seeking efficient logic operations. Ideal for military-grade projects and automotive applications, these logic gates ensure seamless operation and superior functionality. Trust Onsemi's expertise and choose the NLV74HC02ADTR2G for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in reducing the overall weight of the package and also provides good insulation properties.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures fast signal processing and high-speed operation of the logic gates.

Surface Mount: YES

Surface mount capability makes it easy to integrate the logic gates onto PCBs, saving space and enabling efficient mass production.

No. of Functions: 4

Having multiple functions in a single package offers versatility and efficiency in circuit design.

Screening Level: AEC-Q100

This screening level ensures high reliability and quality, making the product suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with other components and enables easy integration into existing systems.

Load Capacitance (CL): 50 pF

Having a specified load capacitance helps in designing circuits with accurate timing and signal integrity.

Power Supplies (V): 2/6

Supporting power supplies of 2V and 6V provides flexibility in operating voltage range, making the product versatile for various applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch packaging enhance space efficiency and ease of PCB layout.

Maximum I (ol): 4 Amp

High output current capability allows the logic gates to drive larger loads, expanding their applicability.

Propagation Delay (tpd): 110 ns

Although not the fastest, the propagation delay of 110ns is reasonable for many applications and offers a good balance between speed and power consumption.

Maximum Operating Temperature: 125 °C

Being able to operate at high temperatures ensures reliability and longevity in various environmental conditions.

Minimum Operating Temperature: -55 °C

The wide temperature range from -55 °C to 125°C allows the logic gates to function in extreme conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold as terminal finish provides corrosion resistance and good electrical conductivity, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning facilitates easier PCB mounting and soldering, enhancing the overall ease of assembly.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2mm allows for compact and slim designs, particularly in space-constrained applications.

Width: 4.4 mm

With a narrow width of 4.4mm, the logic gates can be densely packed on a PCB, maximizing board space utilization.

Minimum Supply Voltage (Vsup): 2 V

Supporting a minimum supply voltage of 2V enables operation in low-power scenarios and extends the range of possible applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature ensures proper soldering and reliability during assembly processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260 °C, the logic gates can withstand the rigors of soldering processes without damage.

Length: 5 mm

The compact length of 5mm further contributes to the overall small form factor and space-saving design of the product.

Temperature Grade: MILITARY

Having a military-grade temperature rating ensures robust performance and reliability in harsh operating conditions and critical applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of other components.

Terminal Form: GULL WING

The gull wing terminal form facilitates surface mounting and provides mechanical stability during assembly and operation.

Packing Method: TR

The tape and reel packing method is convenient for automated pick-and-place assembly processes, saving time and reducing the risk of handling damage.

Terminal Pitch: 0.65 mm

With a small terminal pitch of 0.65mm, the logic gates can be densely packed on a PCB, increasing design flexibility and density.

Maximum Supply Voltage (Vsup): 6 V

Supporting a maximum supply voltage of 6V ensures compatibility with a wide range of power sources and operating conditions, enhancing versatility.

Technical Specifications

Logic Gates NLV74HC02ADTR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV74HC02ADTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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