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NLU1GT126AMX1TCG

Onsemi

NLU1GT126AMX1TCG by Onsemi

NLU1GT126AMX1TCG by Onsemi is a CMOS Logic Gate with 16ns Propagation Delay, suitable for military applications. It operates at 5V with 50pF Load Capacitance and features a 3-STATE Output. This small outline package has a very thin profile, making it ideal for space-constrained designs.

Median Price

$0.183

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 600 parts In-Stock

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Verical

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Digiode

USA . 2,441 parts In-Stock

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J2 Sourcing AB

Sweden . 11,700 parts In-Stock

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Vyrian

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Corphita

USA . 1,578 parts In-Stock

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Corohmni

South Africa . 249 parts In-Stock

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AZTECH Wire

Italy . 148 parts In-Stock

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$14.770

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QUARKTWIN TECHNOLOGY LTD

USA . 11,836 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

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SupplyDigital Components

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Problanco Electronics

Mexico . 3,942 parts In-Stock

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TANS Electronics

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Futuretech Components

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UHIMA Technologies

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Microchip USA

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Overview

Looking for high-quality logic gates for your electronic projects? Look no further than the NLU1GT126AMX1TCG by Onsemi. With a reputation for excellence in manufacturing, Onsemi delivers reliable and durable components. This logic gate is versatile and can be used in a wide range of applications. From consumer electronics to industrial machinery, this product offers fast propagation delay, low power consumption, and a small outline package design. Trust Onsemi to provide you with top-notch components that will enhance the performance of your devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 16 ns

With a low propagation delay, this product ensures fast signal processing and efficient operation.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operating at a widely used supply voltage of 5V, this product can be easily integrated into various electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing power consumption and ensures stable performance under different loading conditions.

Power Supplies (V): 1.8/5

Supporting multiple power supply options makes this product versatile and adaptable to different voltage requirements.

No. of Terminals: 6

Having 6 terminals provides flexibility in connectivity and allows for integration with other components in the circuit.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The compact and thin profile design saves space on the circuit board and makes it suitable for applications with limited space constraints.

Maximum I (ol): 4 Amp

With a high output current capability, this product can drive external loads with ease and reliability.

Propagation Delay (tpd): 16 ns

The consistent propagation delay ensures reliable signal propagation and synchronization in digital circuits.

Maximum Operating Temperature: 125 °C

Operating at a high temperature range ensures the product's reliability and performance in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance output, enabling bus sharing and preventing conflicts in multi-driver circuits.

Minimum Operating Temperature: -55 °C

The wide operating temperature range ensures the product's functionality in both extreme cold and hot environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish provides good electrical conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position offers flexibility in connectivity options, allowing for various connection configurations.

Maximum Seated Height: 0.4 mm

The low seated height makes this product suitable for applications with tight height restrictions or where space is limited.

Width: 1 mm

The compact width size makes it easy to fit this product into densely packed circuit boards or small enclosures.

Output Polarity: TRUE

The true output polarity ensures correct signal interpretation and compatibility with other components in the circuit.

Minimum Supply Voltage (Vsup): 1.65 V

Operating at a low minimum supply voltage allows for energy-efficient operation and compatibility with low-power systems.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes this product suitable for reflow soldering processes, ensuring reliable solder joints.

Length: 1.45 mm

The compact length size makes it easy to integrate this product into tight spaces and miniaturized electronic devices.

Temperature Grade: MILITARY

Meeting military-grade standards ensures high reliability, ruggedness, and performance in demanding applications and harsh environments.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, making this product energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form meets environmental regulations, reduces waste, and simplifies the product's disposal and recycling process.

Packing Method: TR

The TR packing method provides protection during shipping and handling, ensuring the product's integrity and reliability upon delivery.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for dense packing on the circuit board, enabling high-performance and space-efficient electronic designs.

Control Type: ENABLE HIGH

With a high enable control type, this product offers flexibility in signal routing and system integration, allowing for efficient circuit operation.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V ensures compatibility with high-voltage applications and provides a safety margin for voltage spikes.

Technical Specifications

Logic Gates NLU1GT126AMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Family:

1G

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLU1GT126AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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