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NLU1GT126AMUTCG

Onsemi

NLU1GT126AMUTCG by Onsemi

NLU1GT126AMUTCG by Onsemi is a CMOS Logic Gate with 16ns Propagation Delay at 5V, suitable for military applications. It features a 3-STATE output and operates b/w -55 to 125 °C. The package is small outline, very thin profile, making it ideal for space-constrained designs.

Median Price

$0.093

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 69,000 parts In-Stock

1+ parts

-

100+ parts

$0.093

1k+ parts

$0.077

10k+ parts

$0.069

69,000

-

$0.093

$0.077

$0.069

DigiKey

USA . 69,000 parts In-Stock

1+ parts

-

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$0.120

69,000

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$0.120

Verical

USA . 60,000 parts In-Stock

1+ parts

-

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$0.086

60,000

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$0.086

Distributors (In-Stock)

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Digiode

USA . 923 parts In-Stock

1+ parts

$0.076

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923

$0.076

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Chip Stock

USA . 31,000 parts In-Stock

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31,000

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Vyrian

USA . 5,659 parts In-Stock

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5,659

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Distributors (Availability)

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Corphita

USA . 211 parts In-Stock

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$0.072

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211

$0.072

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Corohmni

South Africa . 107 parts In-Stock

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$0.080

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107

$0.080

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Andel Nordic

Denmark . 2,357 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

$4.900

10k+ parts

$4.900

2,357

$7.000

-

$4.900

$4.900

AZTECH Wire

Italy . 642 parts In-Stock

1+ parts

$13.740

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642

$13.740

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Continental Prestige Electronics

USA . 75,000 parts In-Stock

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$0.066

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75,000

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$0.066

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Problanco Electronics

Mexico . 7,759 parts In-Stock

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7,759

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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TANS Electronics

Latvia . 4,709 parts In-Stock

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Kulean Microsystems

USA . 3,363 parts In-Stock

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3,363

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SupplyDigital Components

Austria . 2,766 parts In-Stock

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2,766

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UHIMA Technologies

Türkiye . 599 parts In-Stock

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599

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Microchip USA

USA . 396 parts In-Stock

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396

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Overview

Discover the unmatched quality and reliability of the NLU1GT126AMUTCG logic gate by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch products that exceed expectations. This versatile logic gate is perfect for a wide range of applications, offering fast propagation delay, low power consumption, and high output characteristics. With a compact package design and military-grade temperature rating, this product provides exceptional value and performance. Upgrade your projects with the NLU1GT126AMUTCG and experience the benefits of superior technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to damage, ensuring the reliability of the product.

Propagation Delay At Nominal Supply: 16 ns

The quick propagation delay at nominal supply ensures speedy signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of the product on circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard voltage requirements, making it versatile and widely applicable in various electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF allows for efficient energy consumption and reduces the risk of signal distortion, enhancing the performance of the logic gates.

Power Supplies (V): 1.8/5

Supporting power supplies of 1.8V and 5V provides flexibility in operating voltage options, making it suitable for a range of different electronic devices.

No. of Terminals: 6

Having 6 terminals allows for multiple connection points, enabling complex circuit configurations and improving the functionality of the logic gates.

Maximum I (ol): 4 Amp

The high maximum output current of 4 Amps ensures robust performance and reliable operation under heavy loads, making it suitable for demanding applications.

Technical Specifications

Logic Gates NLU1GT126AMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Family:

1G

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

16 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NLU1GT126AMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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