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NLSV8T244DWR2G

Onsemi

NLSV8T244DWR2G by Onsemi

NLSV8T244DWR2G by Onsemi is an 8-bit bus driver/transceiver with a nominal voltage of 3.3V and propagation delay of 3.3ns. It features a small outline package style, operates in industrial temperature grade range (-40 to 85 °C), and is suitable for applications requiring true output polarity control in compact designs.

Median Price

$3.935

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,257 parts In-Stock

1+ parts

$2.370

100+ parts

$2.230

1k+ parts

$2.010

10k+ parts

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3,257

$2.370

$2.230

$2.010

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DigiKey

USA . 2 parts In-Stock

1+ parts

$5.500

100+ parts

-

1k+ parts

$2.031

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2

$5.500

-

$2.031

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,217 parts In-Stock

1+ parts

$2.252

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1,217

$2.252

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Vyrian

USA . 2,124 parts In-Stock

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2,124

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Speed Components Ltd

Israel . 19 parts In-Stock

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LWI Electronics Inc

India . 10 parts In-Stock

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10

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Distributors (Availability)

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Corphita

USA . 341 parts In-Stock

1+ parts

$2.133

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-

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341

$2.133

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Corohmni

South Africa . 388 parts In-Stock

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$2.370

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388

$2.370

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Vigor

Singapore . 215 parts In-Stock

1+ parts

$3.050

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215

$3.050

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Problanco Electronics

Mexico . 7,414 parts In-Stock

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SupplyDigital Components

Austria . 6,626 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,558 parts In-Stock

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6,558

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TANS Electronics

Latvia . 4,612 parts In-Stock

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Kulean Microsystems

USA . 2,193 parts In-Stock

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Perfect Parts

USA . 1,281 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Microchip USA

USA . 521 parts In-Stock

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521

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UHIMA Technologies

Türkiye . 411 parts In-Stock

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411

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Overview

Unlock the power of seamless communication with the NLSV8T244DWR2G by Onsemi! Crafted with precision and expertise, this bus driver & transceiver offers unparalleled quality and reliability. Ideal for a wide range of applications, this product ensures smooth data transmission with its 3-STATE output characteristics. With a compact design and high-performance features, customers can trust in the value and benefits this product brings to their projects. Invest in excellence with Onsemi's NLSV8T244DWR2G and experience enhanced connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product suitable for rugged environments.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and simplifying assembly processes.

No. of Bits: 8

Provides sufficient data transmission capabilities for bus driver and transceiver applications.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal operating voltage for efficient performance and power consumption.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with elevated temperatures, ensuring reliable operation.

Output Characteristics: 3-STATE

Allows for tristate output operation, enabling flexible signal control and management.

Technical Specifications

Bus Driver & Transceivers NLSV8T244DWR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

8T

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1/4.3

Propagation Delay (tpd):

3.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NLSV8T244DWR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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