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NLSV1T244MUTAG

Onsemi

NLSV1T244MUTAG by Onsemi

NLSV1T244MUTAG by Onsemi is a 6-terminal bus driver with 3.3ns propagation delay and TRUE output polarity. It operates b/w -40 to 85 °C, suitable for industrial applications requiring small outline and low profile packages. With a supply voltage range of 0.9V to 4.5V, it is ideal for compact electronic devices needing efficient signal transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,118 parts In-Stock

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Digiode

USA . 467 parts In-Stock

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467

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TANS Electronics

Latvia . 7,390 parts In-Stock

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7,390

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SupplyDigital Components

Austria . 5,033 parts In-Stock

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Problanco Electronics

Mexico . 4,006 parts In-Stock

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4,006

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UHIMA Technologies

Türkiye . 855 parts In-Stock

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855

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Corphita

USA . 545 parts In-Stock

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Corohmni

South Africa . 340 parts In-Stock

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340

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Kulean Microsystems

USA . 257 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the NLSV1T244MUTAG by Onsemi. This high-quality bus driver & transceiver is a game-changer in the industry, offering unparalleled performance and reliability. With its surface mount capability and small outline, very thin profile package style, it's perfect for a wide range of applications. Experience fast propagation delay, true output polarity, and 3-state output characteristics. Trust Onsemi's expertise and innovation to elevate your projects to new heights. Choose the NLSV1T244MUTAG for superior value, benefits, and advantages that will exceed your expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing overall product size.

Package Shape: RECTANGULAR

Rectangular shape makes the component easy to handle and place on the circuit board, ensuring compatibility and ease of use.

Nominal Supply Voltage / Vsup (V): 1.2

Provides a stable and standard supply voltage for the bus driver & transceivers, ensuring consistent performance.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Compact package style with a very thin profile allows for high-density mounting and efficient use of space on the circuit board.

Propagation Delay (tpd): 3.3 ns

Low propagation delay ensures fast signal transmission and minimal delay in data transfer, improving overall system performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows the component to function reliably in various environmental conditions without overheating.

Output Characteristics: 3-STATE

3-STATE output allows the driver to be disabled or put in high impedance state when not in use, reducing power consumption and preventing signal interference.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the component can operate in harsh industrial environments without degradation in performance.

Technical Specifications

Bus Driver & Transceivers NLSV1T244MUTAG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

1T

JESD-30 Code:

R-XDSO-N6

Length:

1.2 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

3.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1 mm

Trade Compliance

NLSV1T244MUTAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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