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NLSV1T34AMUTAG

Onsemi

NLSV1T34AMUTAG by Onsemi

NLSV1T34AMUTAG by Onsemi is a CMOS bus driver with 6 terminals, operating at a supply voltage range of 0.9-4.5V. It features a propagation delay of 3.3ns and can handle a max current of 2A, making it suitable for industrial applications requiring fast signal translation and low power consumption. The small outline package with very thin profile and surface mount capability further enhance its versatility in compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 501 parts In-Stock

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Vyrian

USA . 478 parts In-Stock

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Problanco Electronics

Mexico . 6,548 parts In-Stock

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TANS Electronics

Latvia . 4,507 parts In-Stock

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SupplyDigital Components

Austria . 2,717 parts In-Stock

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Kulean Microsystems

USA . 1,839 parts In-Stock

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UHIMA Technologies

Türkiye . 658 parts In-Stock

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Corohmni

South Africa . 105 parts In-Stock

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Corphita

USA . 85 parts In-Stock

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Overview

Experience seamless connectivity and efficient data transmission with the NLSV1T34AMUTAG by Onsemi. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled reliability and performance in a compact and durable package. Ideal for a wide range of applications, this product provides seamless translation at low power consumption levels. Elevate your projects with the quality and innovation that only Onsemi can deliver, and unlock a world of possibilities with the NLSV1T34AMUTAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easier and more efficient installation onto circuit boards.

Nominal Supply Voltage / Vsup (V): 1.2

Optimal supply voltage for reliable performance.

Propagation Delay (tpd): 3.3 ns

Fast signal propagation for quick and efficient data transmission.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without issues.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments without issues.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers NLSV1T34AMUTAG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

1T

JESD-30 Code:

R-PDSO-N6

Length:

1.45 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

2 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

.004 mA

Propagation Delay (tpd):

3.3 ns

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Translation:

0.9/4.5V & 0.9/4.5V

Width:

1 mm

Trade Compliance

NLSV1T34AMUTAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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