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NLSV4T240EDR2G

Onsemi

NLSV4T240EDR2G by Onsemi

NLSV4T240EDR2G by Onsemi is a 14-terminal bus driver with 5ns propagation delay, operating b/w -40 to 85 °C. It features inverted output polarity and 3-STATE characteristics, suitable for industrial applications requiring small outline packages and dual terminal positions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,036 parts In-Stock

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2,036

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Digiode

USA . 1,627 parts In-Stock

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1,627

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Distributors (Availability)

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Vigor

Singapore . 416 parts In-Stock

1+ parts

$0.920

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416

$0.920

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Microchip USA

USA . 4,405 parts In-Stock

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$6.884

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4,405

$6.884

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AZTECH Wire

Italy . 746 parts In-Stock

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$12.080

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746

$12.080

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$30.553

100+ parts

$27.803

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$25.053

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2,000

$30.553

$27.803

$25.053

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Problanco Electronics

Mexico . 6,430 parts In-Stock

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6,430

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TANS Electronics

Latvia . 4,213 parts In-Stock

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Kulean Microsystems

USA . 949 parts In-Stock

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Corphita

USA . 715 parts In-Stock

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SupplyDigital Components

Austria . 526 parts In-Stock

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Corohmni

South Africa . 103 parts In-Stock

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UHIMA Technologies

Türkiye . 56 parts In-Stock

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Overview

The NLSV4T240EDR2G by Onsemi is a top-of-the-line bus driver & transceiver that offers unparalleled quality and reliability. With a wide range of applications, this product is perfect for various industries seeking high-performance solutions. Onsemi, known for its cutting-edge technology and innovation, delivers a product that exceeds expectations in terms of value and benefits. Experience seamless operation and efficiency with the NLSV4T240EDR2G, a must-have for any business looking to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver/transceiver.

Surface Mount: YES

Allows easy installation and soldering onto circuit boards, saving time and effort.

Nominal Supply Voltage / Vsup (V): 1.5

Optimal supply voltage for efficient operation and performance.

Propagation Delay (tpd): 5 ns

Fast propagation delay ensures quick signal transmission and response times.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

Output Characteristics: 3-STATE

Allows for high impedance output state, enhancing flexibility in bus control.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions without compromising performance.

Terminal Finish: MATTE TIN

Provides reliable and corrosion-resistant terminal connections.

Width: 3.9 mm

Compact size enables efficient use of space on circuit boards.

Output Polarity: INVERTED

Allows for compatibility with a wide range of devices and systems.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures safe and effective reflow soldering process during assembly.

Temperature Grade: INDUSTRIAL

Designed to meet the high temperature requirements of industrial applications.

Terminal Form: GULL WING

Facilitates easy and secure soldering of the terminals onto circuit boards.

Maximum Supply Voltage (Vsup): 4.5 V

Can handle higher supply voltages for versatile compatibility with various systems.

Technical Specifications

Bus Driver & Transceivers NLSV4T240EDR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLSV4T240EDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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