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NLSV1T240MUTAG

Onsemi

NLSV1T240MUTAG by Onsemi

NLSV1T240MUTAG by Onsemi is a 6-terminal bus driver with 3.3ns propagation delay, operating b/w -40 to 85 °C. It features TRUE output polarity and supports industrial temperature grade applications. This surface-mount device has a small outline package style and is suitable for dual-port systems requiring low supply voltage of 0.9V to 4.5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,994 parts In-Stock

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Vyrian

USA . 1,373 parts In-Stock

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1,373

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Distributors (Availability)

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Problanco Electronics

Mexico . 7,645 parts In-Stock

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TANS Electronics

Latvia . 4,950 parts In-Stock

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SupplyDigital Components

Austria . 3,413 parts In-Stock

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Kulean Microsystems

USA . 2,774 parts In-Stock

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Corphita

USA . 1,573 parts In-Stock

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UHIMA Technologies

Türkiye . 439 parts In-Stock

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Corohmni

South Africa . 161 parts In-Stock

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Overview

Experience seamless communication and reliable performance with the NLSV1T240MUTAG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality bus drivers & transceivers that are ideal for a wide range of applications. With its small outline, very thin profile package style, this product offers convenience and flexibility in installation. Whether you're looking to enhance your automotive electronics or industrial automation systems, the NLSV1T240MUTAG provides efficient output characteristics and minimal propagation delay. Trust Onsemi for superior products that bring value and benefits to your projects.

Feature Benefit Bullets

Surface Mount: YES

Easy to install on printed circuit boards, saves space and reduces assembly time.

Nominal Supply Voltage / Vsup (V): 1.2

Optimal supply voltage for efficient performance and power consumption.

Propagation Delay (tpd): 3.3 ns

Fast signal propagation for quick response times in data transmission.

Maximum Operating Temperature: 85 °C

Suitable for a wide range of operating environments and conditions.

Minimum Operating Temperature: -40 °C

Can withstand low temperature conditions, suitable for various climates.

Output Characteristics: 3-STATE

Provides flexibility in managing output signals with high impedance state.

Width: 1 mm

Compact size for easy integration and space-saving in circuit design.

Output Polarity: TRUE

Ensures correct polarity of output signals for accurate data transmission.

Maximum Supply Voltage (Vsup): 4.5 V

Can handle higher supply voltages for robust operations and overvoltage protection.

Technical Specifications

Bus Driver & Transceivers NLSV1T240MUTAG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

1T

JESD-30 Code:

R-XDSO-N6

Length:

1.2 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

3.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1 mm

Trade Compliance

NLSV1T240MUTAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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