Loading...

NLSV4T240EDTR2G

Onsemi

NLSV4T240EDTR2G by Onsemi

NLSV4T240EDTR2G by Onsemi is a 14-terminal bus driver with 5ns propagation delay, operating b/w -40 to 85 °C. It features inverted output polarity and supports a supply voltage range of 0.9V to 4.5V. Ideal for industrial applications requiring small outline packages and dual terminal positions.

Median Price

$1.170

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22,061 parts In-Stock

1+ parts

-

100+ parts

$1.170

1k+ parts

$0.971

10k+ parts

$0.866

22,061

-

$1.170

$0.971

$0.866

DigiKey

USA . 22,061 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.000

10k+ parts

-

22,061

-

-

$1.000

-

Verical

USA . 22,061 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.214

10k+ parts

$1.082

22,061

-

-

$1.214

$1.082

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 625 parts In-Stock

1+ parts

$0.725

100+ parts

-

1k+ parts

-

10k+ parts

-

625

$0.725

-

-

-

Digiode

USA . 534 parts In-Stock

1+ parts

$0.910

100+ parts

-

1k+ parts

-

10k+ parts

-

534

$0.910

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 465 parts In-Stock

1+ parts

$0.725

100+ parts

-

1k+ parts

-

10k+ parts

-

465

$0.725

-

-

-

Vigor

Singapore . 294 parts In-Stock

1+ parts

$0.840

100+ parts

-

1k+ parts

-

10k+ parts

-

294

$0.840

-

-

-

Corphita

USA . 1,401 parts In-Stock

1+ parts

$0.862

100+ parts

-

1k+ parts

-

10k+ parts

-

1,401

$0.862

-

-

-

Component Stockers USA

USA . 32,839 parts In-Stock

1+ parts

$0.990

100+ parts

$0.930

1k+ parts

$0.840

10k+ parts

$0.840

32,839

$0.990

$0.930

$0.840

$0.840

Microchip USA

USA . 3,784 parts In-Stock

1+ parts

$6.418

100+ parts

-

1k+ parts

-

10k+ parts

-

3,784

$6.418

-

-

-

Continental Prestige Electronics

USA . 22,061 parts In-Stock

1+ parts

-

100+ parts

$1.150

1k+ parts

-

10k+ parts

-

22,061

-

$1.150

-

-

Kulean Microsystems

USA . 5,956 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,956

-

-

-

-

Problanco Electronics

Mexico . 2,942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,942

-

-

-

-

TANS Electronics

Latvia . 2,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,215

-

-

-

-

SupplyDigital Components

Austria . 1,343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,343

-

-

-

-

UHIMA Technologies

Türkiye . 837 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

837

-

-

-

-

Overview

Experience high-quality performance with the NLSV4T240EDTR2G by Onsemi, a reliable bus driver and transceiver designed to meet your connectivity needs. With a package body material of PLASTIC/EPOXY and surface mount capabilities, this product offers ease of installation and durability. Ideal for industrial applications, this small outline package comes with a number of terminals for versatile connectivity options. Trust in the reputation of Onsemi as a leading manufacturer to deliver top-notch solutions for your electronic needs. Unlock the value and benefits of the NLSV4T240EDTR2G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making it ideal for electronic components that may experience frequent handling or movement.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

No. of Terminals: 14

Having 14 terminals allows for a higher level of connectivity and functionality in the circuit design.

Propagation Delay (tpd): 5 ns

With a low propagation delay of 5 nanoseconds, this product ensures fast and efficient signal transmission in data communication applications.

Output Characteristics: 3-STATE

The 3-STATE output allows the device to be in one of three states (high, low, or high-impedance), providing flexibility in controlling the output signal.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, this product is suitable for harsh environmental conditions and high reliability applications.

Technical Specifications

Bus Driver & Transceivers NLSV4T240EDTR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLSV4T240EDTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19