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NLSV4T244EMUTAG

Onsemi

NLSV4T244EMUTAG by Onsemi

NLSV4T244EMUTAG by Onsemi is a 4-bit bus driver with 3-STATE output, operating at a supply voltage range of 0.9V to 4.5V. It features a propagation delay of 5ns and can withstand temperatures from -40°C to 85°C. Ideal for industrial applications requiring fast signal transmission in compact spaces due to its very thin profile chip carrier package.

Median Price

$4.235

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 2,438 parts In-Stock

1+ parts

$5.560

100+ parts

$3.813

1k+ parts

$2.714

10k+ parts

-

2,438

$5.560

$3.813

$2.714

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Rochester

USA . 4,593 parts In-Stock

1+ parts

-

100+ parts

$2.910

1k+ parts

$2.600

10k+ parts

$2.450

4,593

-

$2.910

$2.600

$2.450

Distributors (In-Stock)

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$3.029

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-

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700

$3.029

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Mobius Materials

USA . 131 parts In-Stock

1+ parts

$3.440

100+ parts

$2.740

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-

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131

$3.440

$2.740

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Digiode

USA . 1,798 parts In-Stock

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$5.282

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1,798

$5.282

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Flip Electronics

USA . 15,052 parts In-Stock

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15,052

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Chip Stock

USA . 3,900 parts In-Stock

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3,900

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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3,000

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Vyrian

USA . 2,556 parts In-Stock

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2,556

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Component Sense

UK . 1,241 parts In-Stock

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Electronic Treasures

USA . 93 parts In-Stock

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93

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Distributors (Availability)

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Corohmni

South Africa . 246 parts In-Stock

1+ parts

$3.400

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246

$3.400

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Semicontronic

India . 2,309 parts In-Stock

1+ parts

$4.730

100+ parts

$4.612

1k+ parts

$4.588

10k+ parts

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2,309

$4.730

$4.612

$4.588

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Ampacity Inc.

Singapore . 2,294 parts In-Stock

1+ parts

$4.730

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2,294

$4.730

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Corphita

USA . 1,544 parts In-Stock

1+ parts

$5.004

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1,544

$5.004

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AZTECH Wire

Italy . 102 parts In-Stock

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$8.420

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102

$8.420

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Microchip USA

USA . 2,805 parts In-Stock

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$19.394

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2,805

$19.394

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$26.726

100+ parts

$24.321

1k+ parts

$21.915

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3,000

$26.726

$24.321

$21.915

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Perfect Parts

USA . 85,145 parts In-Stock

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85,145

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Continental Prestige Electronics

USA . 16,016 parts In-Stock

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$3.880

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16,016

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$3.880

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Lixinc

USA . 15,377 parts In-Stock

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GreenTree Electronics

Israel . 11,774 parts In-Stock

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SupplyDigital Components

Austria . 7,235 parts In-Stock

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TANS Electronics

Latvia . 7,009 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,931 parts In-Stock

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RC Electronics

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 3,855 parts In-Stock

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Argo Parts USA

USA . 3,446 parts In-Stock

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Kulean Microsystems

USA . 1,125 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$2.969

1k+ parts

$2.878

10k+ parts

$2.817

1,000

-

$2.969

$2.878

$2.817

UHIMA Technologies

Türkiye . 664 parts In-Stock

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664

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Kepictronics

USA . 50 parts In-Stock

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50

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Overview

Discover the superior quality and reliability of the NLSV4T244EMUTAG by Onsemi, a leading manufacturer in the industry. This Bus Driver & Transceiver offers seamless integration and versatile applications, making it an essential component for your projects. With its advanced features and innovative design, this product provides unmatched value, benefits, and advantages to customers looking for top-notch performance and efficiency. Upgrade your systems with the best in class technology from Onsemi and experience the difference firsthand.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making this product suitable for space-constrained applications.

No. of Bits: 4

Having 4 bits allows for more versatility and flexibility in data transmission, making this product suitable for a variety of communication protocols.

Nominal Supply Voltage / Vsup (V): 1.5

Operating at a low supply voltage of 1.5V reduces power consumption and makes this product energy-efficient.

Propagation Delay (tpd): 5 ns

With a fast propagation delay of 5ns, this product offers quick signal transmission, ensuring efficient communication.

Maximum Operating Temperature: 85 °C

Being able to operate at a high temperature of 85°C makes this product suitable for industrial environments with elevated temperatures.

Output Characteristics: 3-STATE

The 3-state output allows the driver/transceiver to tri-state the output line, providing flexibility in controlling the bus signals.

Minimum Supply Voltage (Vsup): 0.9 V

The ability to operate at a low minimum supply voltage of 0.9V allows for compatibility with a wide range of power sources.

Technical Specifications

Bus Driver & Transceivers NLSV4T244EMUTAG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

4T

JESD-30 Code:

R-XQCC-N12

JESD-609 Code:

e4

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

5 ns

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.7 mm

Trade Compliance

NLSV4T244EMUTAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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