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NLSV4T244EDR2G

Onsemi

NLSV4T244EDR2G by Onsemi

NLSV4T244EDR2G by Onsemi is a 4-bit bus driver with 3-STATE output, operating at -40 to 85 °C. It has a propagation delay of 5ns and supports a supply voltage range from 0.9V to 4.5V. Ideal for industrial applications requiring small outline packages and dual terminal positions.

Median Price

$1.300

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.060

10k+ parts

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20,000

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-

$1.060

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Flip Electronics (Authorized)

USA . 20,000 parts In-Stock

1+ parts

-

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20,000

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Rochester

USA . 11,057 parts In-Stock

1+ parts

-

100+ parts

$1.300

1k+ parts

$1.080

10k+ parts

$0.962

11,057

-

$1.300

$1.080

$0.962

Verical

USA . 8,607 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.350

10k+ parts

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8,607

-

-

$1.350

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,362 parts In-Stock

1+ parts

$0.806

100+ parts

-

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1,362

$0.806

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Digiode

USA . 122 parts In-Stock

1+ parts

$1.016

100+ parts

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122

$1.016

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Flip Electronics

USA . 17,500 parts In-Stock

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17,500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 15,264 parts In-Stock

1+ parts

$0.690

100+ parts

-

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15,264

$0.690

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Corohmni

South Africa . 314 parts In-Stock

1+ parts

$0.806

100+ parts

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314

$0.806

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Vigor

Singapore . 284 parts In-Stock

1+ parts

$0.880

100+ parts

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284

$0.880

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Corphita

USA . 766 parts In-Stock

1+ parts

$0.963

100+ parts

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766

$0.963

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Microchip USA

USA . 5,996 parts In-Stock

1+ parts

$7.144

100+ parts

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5,996

$7.144

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Continental Prestige Electronics

USA . 11,057 parts In-Stock

1+ parts

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100+ parts

$1.280

1k+ parts

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10k+ parts

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11,057

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$1.280

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Kulean Microsystems

USA . 7,541 parts In-Stock

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7,541

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Problanco Electronics

Mexico . 6,037 parts In-Stock

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6,037

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SupplyDigital Components

Austria . 5,257 parts In-Stock

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5,257

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TANS Electronics

Latvia . 2,224 parts In-Stock

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2,224

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UHIMA Technologies

Türkiye . 952 parts In-Stock

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952

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Overview

Elevate your electronic projects with the NLSV4T244EDR2G by Onsemi, a top-of-the-line bus driver and transceiver that delivers unparalleled quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this small outline package features 3-state output characteristics and a true output polarity for seamless integration. With a wide operating temperature range and dual terminal position, this product is ideal for industrial applications where precision and efficiency are paramount. Experience the value and benefits of this exceptional component - upgrade to the NLSV4T244EDR2G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the bus driver & transceivers from external elements, increasing product longevity.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly process.

Nominal Supply Voltage / Vsup (V): 1.5

Optimal supply voltage ensures stable and efficient operation of the bus driver & transceivers, reducing the risk of voltage-related issues.

Propagation Delay (tpd): 5 ns

Low propagation delay ensures fast signal transmission, making the bus driver & transceivers suitable for high-speed communication applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating allows the bus driver & transceivers to operate reliably in harsh environmental conditions, making it ideal for industrial applications.

Technical Specifications

Bus Driver & Transceivers NLSV4T244EDR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

4T

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

5 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLSV4T244EDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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