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NL17SZ86DFT2

Onsemi

NL17SZ86DFT2 by Onsemi

NL17SZ86DFT2 by Onsemi is a logic gate with 2 inputs and a propagation delay of 5.9 ns. It operates at a nominal voltage of 1.8V and can handle load capacitance up to 50 pF. This small outline, thin profile package is suitable for military applications.

Median Price

$0.079

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,924 parts In-Stock

1+ parts

-

100+ parts

$0.079

1k+ parts

$0.066

10k+ parts

$0.059

3,924

-

$0.079

$0.066

$0.059

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 42 parts In-Stock

1+ parts

$0.058

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-

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42

$0.058

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Digiode

USA . 1,806 parts In-Stock

1+ parts

$0.062

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1,806

$0.062

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Vyrian

USA . 5,943 parts In-Stock

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Prism Electronics

USA . 25 parts In-Stock

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25

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Vigor

Singapore . 924 parts In-Stock

1+ parts

$0.050

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924

$0.050

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.058

100+ parts

$0.057

1k+ parts

$0.055

10k+ parts

$0.054

2,000

$0.058

$0.057

$0.055

$0.054

Corphita

USA . 2,101 parts In-Stock

1+ parts

$0.058

100+ parts

-

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2,101

$0.058

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Corohmni

South Africa . 381 parts In-Stock

1+ parts

$0.065

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381

$0.065

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Ampacity Inc.

Singapore . 3,522 parts In-Stock

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$0.120

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3,522

$0.120

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AZTECH Wire

Italy . 477 parts In-Stock

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$14.560

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477

$14.560

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Perfect Parts

USA . 28,582 parts In-Stock

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TANS Electronics

Latvia . 6,589 parts In-Stock

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Kulean Microsystems

USA . 3,698 parts In-Stock

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SupplyDigital Components

Austria . 3,352 parts In-Stock

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Problanco Electronics

Mexico . 1,945 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 959 parts In-Stock

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959

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UHIMA Technologies

Türkiye . 617 parts In-Stock

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617

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Microchip USA

USA . 475 parts In-Stock

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475

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Overview

Discover the NL17SZ86DFT2 by Onsemi, a high-quality logic gate that offers unrivaled performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this product is designed to meet the demands of various applications. With its compact size and surface mount capability, it provides ease of installation and saves valuable space. Boasting a fast propagation delay and low power consumption, the NL17SZ86DFT2 ensures quick and efficient operation. Whether you're designing automotive systems, consumer electronics, or industrial control systems, this logic gate delivers exceptional value, benefits, and advantages to meet your needs. Upgrade your projects with the NL17SZ86DFT2 and experience the difference today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the logic gates, making it a good choice for long-term use.

Propagation Delay At Nominal Supply:

5.9 ns - The low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed applications.

Surface Mount:

YES - The surface mount feature allows for easy installation and integration into circuit boards, enhancing the overall efficiency and compactness of electronic devices.

No. of Functions:

1 - With a single function, this logic gate simplifies circuit design and reduces component count, making it an ideal choice for space-constrained applications.

No. of Inputs:

2 - Having two inputs enables versatile logical operations and compatibility with various digital circuits, making this product adaptable for different applications.

Package Shape:

RECTANGULAR - The rectangular shape facilitates easy placement and alignment on circuit boards, improving production efficiency and ensuring accurate connections.

Nominal Supply Voltage / Vsup (V):

1.8 - The low nominal supply voltage requirement not only saves power but also reduces heat dissipation, making this product energy-efficient and suitable for portable devices.

Load Capacitance (CL):

50 pF - The specified load capacitance allows for proper circuit operation and ensures signal integrity, making it a reliable choice for various applications.

Power Supplies (V):

3.3 - The required power supply voltage of 3.3V is commonly available, making this logic gate compatible with a wide range of electronic systems.

No. of Terminals:

5 - The compact size and minimal number of terminals simplify circuit layout, reduce cost, and allow for efficient space utilization in electronic designs.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - The small outline, thin profile, and shrink pitch package style enhance the overall compactness and density of circuit designs, making it suitable for applications with limited space.

Maximum I (ol):

24 Amp - The high maximum output current capability supports driving various loads and ensures reliable signal transmission, making this product suitable for demanding applications.

Propagation Delay (tpd):

14.5 ns - The specified propagation delay time, although slightly longer, still provides efficient signal transition and stable performance, making it suitable for a wide range of applications.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature allows for reliable operation even in harsh environments, making this product suitable for industrial or automotive applications.

Minimum Operating Temperature:

55 °C - The low minimum operating temperature range enables stable performance in extreme cold conditions, making this product suitable for various environments.

Terminal Finish:

TIN LEAD - The specified terminal finish ensures proper solderability and long-term reliability, making it a good choice for applications where robust connections are essential.

Terminal Position:

DUAL - The dual terminal position allows for easy and flexible connectivity options, improving the overall usability and compatibility of this product.

Maximum Seated Height:

1.1 mm - The low maximum seated height helps to reduce the overall height of circuit assemblies, making this logic gate suitable for compact electronic designs.

Width:

1.25 mm - The small width dimensions contribute to space-efficient designs, making this product suitable for applications with tight layout constraints.

Minimum Supply Voltage (Vsup):

1.65 V - The low minimum supply voltage requirement extends the battery life and allows for efficient power management, making this product ideal for portable and low-power devices.

Peak Reflow Temperature °C:

235 - The high peak reflow temperature tolerance ensures proper soldering during manufacturing processes, guaranteeing reliable connections and the overall performance of the product.

Length:

2 mm - The compact length dimensions contribute to space-efficient designs, making this product suitable for applications with tight layout constraints.

Temperature Grade:

MILITARY - The specified military-grade temperature range ensures reliable operation in extreme temperature environments, making this product suitable for defense and aerospace applications.

Technology:

CMOS - The CMOS technology utilized in this logic gate provides low power consumption, high noise immunity, and compatibility with various logic families, making it a versatile choice for different applications.

Terminal Form:

GULL WING - The gull-wing terminal form allows for easy and reliable soldering onto circuit boards, enhancing the overall reliability and durability of the product.

Packing Method:

TR - The specified packing method ensures convenient storage, handling, and protection of the logic gates during transportation and manufacturing processes.

Terminal Pitch:

0.65 mm - The small terminal pitch contributes to compact circuit designs, allowing for higher integration density and improved overall performance.

Moisture Sensitivity Level (MSL):

1 - The specified moisture sensitivity level denotes that the product has a minimal risk of moisture absorption, ensuring long-term reliability and stability.

Maximum Supply Voltage (Vsup):

5.5 V - The high maximum supply voltage tolerance allows for compatibility with a wide range of electronic systems, making this product versatile and suitable for various applications.

Technical Specifications

Logic Gates NL17SZ86DFT2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SZ

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

NL17SZ86DFT2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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