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NL17SZ14P5T5G-L22088

Onsemi

NL17SZ14P5T5G-L22088 by Onsemi

NL17SZ14P5T5G-L22088 by Onsemi is a CMOS Logic Gate with 7.5ns Propagation Delay, 50pF Load Capacitance, and 1.8V Nominal Voltage. Ideal for military applications due to its Schmitt Trigger feature and small outline package style.

Median Price

$0.074

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$0.074

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98

$0.074

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Vyrian

USA . 4,158 parts In-Stock

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4,158

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Digiode

USA . 110 parts In-Stock

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110

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 58 parts In-Stock

1+ parts

$0.073

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58

$0.073

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$0.074

100+ parts

$0.070

1k+ parts

$0.067

10k+ parts

$0.066

100

$0.074

$0.070

$0.067

$0.066

Argo Parts USA

USA . 2,073 parts In-Stock

1+ parts

$0.074

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$0.072

2,073

$0.074

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$0.072

Continental Prestige Electronics

USA . 1,186 parts In-Stock

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$0.074

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$0.073

1,186

$0.074

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$0.073

Microchip USA

USA . 9,110 parts In-Stock

1+ parts

$0.376

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9,110

$0.376

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AZTECH Wire

Italy . 387 parts In-Stock

1+ parts

$19.398

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387

$19.398

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Ampacity Inc.

Singapore . 1,359 parts In-Stock

1+ parts

$61.000

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1,359

$61.000

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Problanco Electronics

Mexico . 8,069 parts In-Stock

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8,069

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Kulean Microsystems

USA . 7,645 parts In-Stock

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TANS Electronics

Latvia . 3,335 parts In-Stock

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SupplyDigital Components

Austria . 2,087 parts In-Stock

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Corphita

USA . 1,101 parts In-Stock

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UHIMA Technologies

Türkiye . 985 parts In-Stock

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985

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Overview

Discover the NL17SZ14P5T5G-L22088 from Onsemi, a top-quality logic gate perfect for a wide range of applications. With a small outline and very thin profile package style, this product offers fast propagation delay, low power consumption, and a wide operating temperature range for reliable performance. Whether you're designing industrial equipment or consumer electronics, this versatile logic gate delivers exceptional value and efficiency. Upgrade your projects with Onsemi's innovative technology and trust in their reputation for superior manufacturing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures fast operation and high efficiency in signal processing.

Surface Mount: YES

Surface mount technology allows for easy integration into circuit boards, saving space and facilitating mass production.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low voltage, making it suitable for battery-powered devices and reducing power consumption.

Load Capacitance (CL): 50 pF

Optimized for a specific load capacitance value, ensuring reliable and stable performance in various applications.

No. of Terminals: 5

Simple design with a minimal number of terminals, reducing complexity and potential points of failure.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Compact size and thin profile make the product suitable for space-constrained applications and enable efficient PCB layout.

Maximum I (ol): 24 Amp

High output current capability allows for driving external loads without the need for additional buffers or amplifiers.

Propagation Delay (tpd): 15.6 ns

Low propagation delay ensures fast response time and high-speed data processing.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -55 °C

Wide temperature range enables operation in extreme cold conditions without compromising performance.

Terminal Finish: TIN

Tin finish provides good solderability and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and facilitates soldering during assembly.

Maximum Seated Height: 0.4 mm

Low seated height saves space and allows for compact design in space-constrained applications.

Width: 0.8 mm

Narrow width facilitates close placement on PCBs, enabling efficient board design and reducing signal interference.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage ensures compatibility with low-voltage systems and extends battery life in portable devices.

Length: 1 mm

Compact length contributes to the overall small form factor of the product, enabling space-efficient designs.

Temperature Grade: MILITARY

Military-grade temperature rating ensures high reliability and performance in harsh environmental conditions and critical applications.

Schmitt Trigger: YES

Schmitt trigger input allows for hysteresis and noise immunity, improving signal integrity and accuracy in digital circuits.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it ideal for various electronic applications.

Terminal Form: FLAT

Flat terminal form simplifies soldering and ensures secure connections during assembly.

Packing Method: TR

Tape and reel packaging method enables automated assembly and convenient handling in mass production environments.

Terminal Pitch: 0.35 mm

Fine terminal pitch allows for high-density mounting on PCBs, maximizing board space utilization.

Maximum Supply Voltage (Vsup): 5.5 V

Wide supply voltage range provides flexibility in system design and compatibility with a variety of power sources.

Maximum Power Supply Current (ICC): 0.01 mA

Low power supply current consumption reduces overall energy consumption and extends battery life in portable devices.

Technical Specifications

Logic Gates NL17SZ14P5T5G-L22088 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL5/6,.03,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

15.6 ns

Schmitt Trigger:

YES

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

.8 mm

Trade Compliance

NL17SZ14P5T5G-L22088 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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