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NL17SZ04P5T5G-L22088

Onsemi

NL17SZ04P5T5G-L22088 by Onsemi

NL17SZ04P5T5G-L22088 by Onsemi is a CMOS Logic Gate with 5.2ns Propagation Delay, 1.8V Nominal Voltage, and 50pF Load Capacitance. Ideal for military applications due to its MILITARY Temperature Grade and small form factor in SMALL OUTLINE package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,003 parts In-Stock

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Digiode

USA . 1,649 parts In-Stock

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Microchip USA

USA . 9,515 parts In-Stock

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$0.390

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AZTECH Wire

Italy . 194 parts In-Stock

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$15.690

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QUARKTWIN TECHNOLOGY LTD

USA . 22,232 parts In-Stock

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SupplyDigital Components

Austria . 7,572 parts In-Stock

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Problanco Electronics

Mexico . 7,145 parts In-Stock

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TANS Electronics

Latvia . 3,484 parts In-Stock

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Kulean Microsystems

USA . 2,689 parts In-Stock

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Corphita

USA . 1,116 parts In-Stock

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UHIMA Technologies

Türkiye . 991 parts In-Stock

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Corohmni

South Africa . 407 parts In-Stock

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Overview

Discover the superior quality and reliability of the NL17SZ04P5T5G-L22088 by Onsemi, a leading manufacturer in the industry. This powerful logic gate offers lightning-fast propagation delay, making it ideal for applications where speed is crucial. With a low nominal supply voltage and high maximum I (ol), this product provides exceptional value and performance. Whether you're designing military-grade equipment or cutting-edge consumer electronics, this logic gate will exceed your expectations. Upgrade your projects with the NL17SZ04P5T5G-L22088 and experience unparalleled efficiency and precision.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

Plastic/Epoxy material provides good protection for the internal components of the logic gates, increasing durability and reliability.

Propagation Delay At Nominal Supply : 5.2 ns

Low propagation delay ensures fast processing of signals, making the logic gates suitable for high-speed applications.

Surface Mount : YES

Surface mount capability makes installation easier and more compact, saving space on the PCB.

Nominal Supply Voltage / Vsup (V) : 1.8

Low supply voltage requirement helps in reducing power consumption and heat dissipation.

Load Capacitance (CL) : 50 pF

Suitable load capacitance for efficient signal transmission and reception.

Maximum Seated Height : 0.4 mm

Low seated height allows for a compact design and efficient use of space on the PCB.

Minimum Supply Voltage (Vsup) : 1.65 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Supply Voltage (Vsup) : 5.5 V

Wide supply voltage range provides flexibility in system design and compatibility with different power sources.

Technical Specifications

Logic Gates NL17SZ04P5T5G-L22088 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL5/6,.03,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

12 ns

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

.8 mm

Trade Compliance

NL17SZ04P5T5G-L22088 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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