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NL17SV00XV5T2

Onsemi

NL17SV00XV5T2 by Onsemi

NL17SV00XV5T2 by Onsemi is a CMOS Logic Gate with 2 inputs, 14.6 ns propagation delay, and 9.9 ns tpd. Ideal for industrial applications, it operates b/w -40 to 85 °C with a supply voltage range of 0.9-3.6 V. This small outline package has a very thin profile and is surface mountable for compact designs.

Median Price

$0.139

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,584 parts In-Stock

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-

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$0.139

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$0.115

10k+ parts

$0.103

1,584

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$0.139

$0.115

$0.103

Avnet

USA . 1,584 parts In-Stock

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1,584

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Digiode

USA . 1,238 parts In-Stock

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$0.108

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Vyrian

USA . 4,944 parts In-Stock

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Vigor

Singapore . 500 parts In-Stock

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$0.070

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$0.070

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Corphita

USA . 1,686 parts In-Stock

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$0.103

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Corohmni

South Africa . 170 parts In-Stock

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$0.114

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$0.114

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Component Stockers USA

USA . 2,199 parts In-Stock

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$0.120

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$0.110

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$0.100

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$0.120

$0.110

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AZTECH Wire

Italy . 636 parts In-Stock

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$8.270

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636

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QUARKTWIN TECHNOLOGY LTD

USA . 29,071 parts In-Stock

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Problanco Electronics

Mexico . 7,491 parts In-Stock

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TANS Electronics

Latvia . 7,095 parts In-Stock

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Kulean Microsystems

USA . 5,532 parts In-Stock

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Microchip USA

USA . 5,260 parts In-Stock

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SupplyDigital Components

Austria . 2,144 parts In-Stock

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UHIMA Technologies

Türkiye . 690 parts In-Stock

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Overview

Looking to enhance your electronic designs? The Onsemi NL17SV00XV5T2 Logic Gates offer top-notch quality and reliability, thanks to the reputable manufacturer Onsemi. These logic gates are perfect for a wide range of applications, providing fast propagation delays and low power consumption. With a compact package style and industrial-grade temperature range, these logic gates deliver exceptional performance while offering ease of integration into your circuit designs. Upgrade your projects with the value and benefits that the NL17SV00XV5T2 Logic Gates bring to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the internal components of the logic gate, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 14.6 ns

With a fast propagation delay, this logic gate can quickly process signals, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3.3

The logic gate operates at a commonly used supply voltage of 3.3V, making it compatible with a wide range of systems and devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this logic gate can withstand harsh environmental conditions without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this logic gate energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates NL17SV00XV5T2 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SV

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Length:

1.6 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

2 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

14.6 ns

Propagation Delay (tpd):

9.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.6 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.2 mm

Trade Compliance

NL17SV00XV5T2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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