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NL17SGU04DFT2G

Onsemi

NL17SGU04DFT2G by Onsemi

NL17SGU04DFT2G by Onsemi is a CMOS Logic Gate with 13.8ns Propagation Delay, 3V Nominal Voltage, and -55 to 125 °C Operating Temperature Range. Ideal for military applications due to its MILITARY temperature grade and small outline package style.

Median Price

$0.059

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 105,000 parts In-Stock

1+ parts

-

100+ parts

$0.061

1k+ parts

$0.051

10k+ parts

$0.045

105,000

-

$0.061

$0.051

$0.045

Verical

USA . 105,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.057

105,000

-

-

-

$0.057

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,265 parts In-Stock

1+ parts

$0.048

100+ parts

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1,265

$0.048

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Vyrian

USA . 5,343 parts In-Stock

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5,343

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,089 parts In-Stock

1+ parts

$0.045

100+ parts

-

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1,089

$0.045

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Component Stockers USA

USA . 126,450 parts In-Stock

1+ parts

$0.050

100+ parts

$0.050

1k+ parts

$0.040

10k+ parts

$0.040

126,450

$0.050

$0.050

$0.040

$0.040

Corohmni

South Africa . 199 parts In-Stock

1+ parts

$0.050

100+ parts

-

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199

$0.050

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Vigor

Singapore . 213 parts In-Stock

1+ parts

$0.090

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-

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213

$0.090

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AZTECH Wire

Italy . 259 parts In-Stock

1+ parts

$8.470

100+ parts

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259

$8.470

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Advanced Electronics

New Zealand . 800 parts In-Stock

1+ parts

$25.412

100+ parts

$25.158

1k+ parts

$24.141

10k+ parts

-

800

$25.412

$25.158

$24.141

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QUARKTWIN TECHNOLOGY LTD

USA . 22,631 parts In-Stock

1+ parts

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22,631

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Kepictronics

USA . 10,000 parts In-Stock

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TANS Electronics

Latvia . 7,963 parts In-Stock

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7,963

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Kulean Microsystems

USA . 7,683 parts In-Stock

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7,683

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SupplyDigital Components

Austria . 6,924 parts In-Stock

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Microchip USA

USA . 3,980 parts In-Stock

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3,980

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Problanco Electronics

Mexico . 3,088 parts In-Stock

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3,088

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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UHIMA Technologies

Türkiye . 694 parts In-Stock

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694

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Overview

Unleash the power of innovation with the NL17SGU04DFT2G by Onsemi! This high-quality logic gate from a trusted manufacturer offers unmatched reliability and performance. Ideal for a wide range of applications, this product provides customers with exceptional value and benefits. Experience faster processing speeds, lower power consumption, and seamless integration into your projects. Elevate your designs with the NL17SGU04DFT2G and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight construction, making it suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 13.8 ns

This low propagation delay enables fast signal processing, making the product efficient in time-critical operations.

Surface Mount: YES

The surface mount feature allows for easy and space-saving installation on printed circuit boards, enhancing the overall design flexibility.

Nominal Supply Voltage / Vsup (V): 3

The 3V supply voltage ensures compatibility with a standard power source, making it easy to integrate into existing systems.

Load Capacitance (CL): 30 pF

The 30pF load capacitance helps to optimize signal integrity and reduce signal distortion, improving overall performance.

No. of Terminals: 5

With 5 terminals, the product offers flexibility in connectivity and can handle multiple input/output signals efficiently.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enhances space utilization and facilitates compact system designs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance in challenging environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C allows for operation in extreme cold environments without risking functionality.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and simplifies the connection process during installation.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1mm enables a slim and compact form factor, ideal for space-constrained applications.

Width: 1.25 mm

The narrow width of 1.25mm makes the product suitable for applications where space is limited, offering a compact solution.

Minimum Supply Voltage (Vsup): 0.9 V

With a minimum supply voltage of 0.9V, the product can operate efficiently even with low power sources, increasing its versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature simplifies the assembly process, ensuring quick and reliable soldering.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C enables proper soldering of the product, ensuring a strong and durable connection to the PCB.

Length: 2 mm

The compact length of 2mm contributes to the overall small form factor, making it suitable for applications where space is a premium.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the product's reliability and performance under harsh operating conditions, making it suitable for critical applications.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high noise immunity, and fast switching speeds, making it an efficient choice for various applications.

Terminal Form: GULL WING

The gull-wing terminal form simplifies the soldering process and provides mechanical strength, ensuring reliable electrical connections.

Packing Method: TR

The TR packing method ensures convenient storage, handling, and transportation of the product, minimizing the risk of damage during transit.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density PCB layouts, maximizing connectivity options and optimizing space usage.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, the product can safely operate within standard voltage limits, providing reliability and protection against overvoltage conditions.

Maximum Power Supply Current (ICC): 0.01 mA

The low maximum power supply current of 0.01mA minimizes power consumption and helps in optimizing energy efficiency, making it suitable for battery-powered applications.

Technical Specifications

Logic Gates NL17SGU04DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SGU

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

.3 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

13.8 ns

Propagation Delay (tpd):

15.6 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NL17SGU04DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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