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NL17SG86AMUTCG

Onsemi

NL17SG86AMUTCG by Onsemi

NL17SG86AMUTCG by Onsemi is a CMOS Logic Gate with 2 inputs, 59.4 ns propagation delay, and operates b/w -55 to 125 °C. Ideal for military applications due to its small outline, very thin profile package style and nickel palladium gold terminal finish.

Median Price

$0.140

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 189,000 parts In-Stock

1+ parts

-

100+ parts

$0.145

1k+ parts

$0.121

10k+ parts

$0.107

189,000

-

$0.145

$0.121

$0.107

Verical

USA . 102,000 parts In-Stock

1+ parts

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$0.134

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$0.134

Distributors (In-Stock)

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Digiode

USA . 461 parts In-Stock

1+ parts

$0.113

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461

$0.113

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Vyrian

USA . 5,112 parts In-Stock

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5,112

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Distributors (Availability)

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Corphita

USA . 725 parts In-Stock

1+ parts

$0.107

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725

$0.107

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Corohmni

South Africa . 242 parts In-Stock

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$0.119

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242

$0.119

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$10.916

100+ parts

$9.934

1k+ parts

$8.951

10k+ parts

-

350

$10.916

$9.934

$8.951

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AZTECH Wire

Italy . 624 parts In-Stock

1+ parts

$15.910

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624

$15.910

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Kulean Microsystems

USA . 7,308 parts In-Stock

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Problanco Electronics

Mexico . 4,079 parts In-Stock

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SupplyDigital Components

Austria . 1,679 parts In-Stock

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1,679

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TANS Electronics

Latvia . 1,007 parts In-Stock

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UHIMA Technologies

Türkiye . 453 parts In-Stock

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453

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Microchip USA

USA . 249 parts In-Stock

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Overview

Looking for high-quality logic gates that deliver top-notch performance? Look no further than the NL17SG86AMUTCG by Onsemi. With a package style of small outline and very thin profile, this versatile component is ideal for a wide range of applications. Whether you're working on military-grade projects or commercial applications, this logic gate offers reliability and efficiency. Trust in Onsemi's reputation for producing superior electronic components and experience the value and benefits that the NL17SG86AMUTCG can bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Inputs: 2

Provides flexibility in creating logic circuits with two input signals.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard supply voltage, ensuring compatibility with common power sources.

Propagation Delay (tpd): 59.4 ns

Offers fast signal processing, allowing for quick response times in logic operations.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Operates reliably in cold temperatures, enhancing the product's versatility.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, improving overall performance.

Technical Specifications

Logic Gates NL17SG86AMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SG

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

59.4 ns

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NL17SG86AMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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