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NCV7708ADWG

Onsemi

NCV7708ADWG by Onsemi

NCV7708ADWG by Onsemi is a Motion Control IC with 28 terminals and a supply voltage range of 3-5V. It features a max output current of 1A, suitable for stepper motor control applications. This small outline package IC has a terminal pitch of 1.27mm and peak reflow temperature of 260 °C, making it ideal for compact designs requiring precise motion control.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 42,000 parts In-Stock

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Digiode

USA . 1,006 parts In-Stock

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France . 77 parts In-Stock

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AZTECH Wire

Italy . 45 parts In-Stock

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SupplyDigital Components

Austria . 8,220 parts In-Stock

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Kulean Microsystems

USA . 7,035 parts In-Stock

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TANS Electronics

Latvia . 2,187 parts In-Stock

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Problanco Electronics

Mexico . 1,830 parts In-Stock

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Corphita

USA . 1,739 parts In-Stock

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Vigor

Singapore . 364 parts In-Stock

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UHIMA Technologies

Türkiye . 213 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 135 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

UK . 62 parts In-Stock

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Overview

Enhance your motion control systems with the NCV7708ADWG by Onsemi. Crafted with precision and expertise, this small outline stepper motor controller offers unparalleled performance and reliability. Perfect for a wide range of applications, this product boasts a nominal supply voltage of 3.3V and a maximum output current of 1A, providing exceptional value and benefits to customers. Trust in Onsemi to deliver top-notch quality and innovation in motion control ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3V allows for compatibility with a wide range of power sources.

No. of Terminals: 28

Having 28 terminals provides flexibility in interfacing with other components and systems, enabling versatile usage.

Maximum Output Current: 1 A

With a maximum output current of 1A, this product can efficiently drive stepper motors and control motion with ease.

Technical Specifications

Motion Control ICs NCV7708ADWG attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 5V NOMINAL SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.925 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

NCV7708ADWG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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