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NCV7702BDWG

Onsemi

NCV7702BDWG by Onsemi

NCV7702BDWG by Onsemi is a Motion Control IC with 2 functions, operating at 7-16V. It is a Stepper Motor Controller in a small outline package suitable for automotive applications. With a temperature range of -40 to 125 °C, it features dual terminals and Gull Wing form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,085 parts In-Stock

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Digiode

USA . 2,286 parts In-Stock

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AZTECH Wire

Italy . 1,115 parts In-Stock

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$10.730

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SupplyDigital Components

Austria . 7,681 parts In-Stock

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Kulean Microsystems

USA . 7,479 parts In-Stock

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Problanco Electronics

Mexico . 3,216 parts In-Stock

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TANS Electronics

Latvia . 2,852 parts In-Stock

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Corphita

USA . 917 parts In-Stock

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Microchip USA

USA . 381 parts In-Stock

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Corohmni

South Africa . 307 parts In-Stock

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UHIMA Technologies

Türkiye . 188 parts In-Stock

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Overview

Enhance your motion control systems with the NCV7702BDWG by Onsemi. Crafted with precision and expertise, this high-quality IC offers reliability and efficiency like no other. Perfect for automotive applications, this product boasts a compact design and a wide operating temperature range, ensuring seamless performance in any environment. With dual functions and easy surface mounting, the NCV7702BDWG provides unparalleled value, making it a top choice for customers looking to elevate their projects to new heights. Trust Onsemi for cutting-edge solutions that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

No. of Functions: 2

Having 2 functions integrated into one IC reduces the number of components required on the PCB, saving space and cost.

Power Supplies (V): 7/16

Wide operating voltage range of 7V to 16V allows for flexibility in various applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable operation even in harsh environments.

Minimum Operating Temperature: -40 °C

Wide temperature range from -40 °C to 125°C makes it suitable for use in automotive applications where temperature fluctuations are common.

Width (mm): 7.5 mm

Narrow width of 7.5mm saves space on the PCB, making it ideal for compact designs.

Other IC type: STEPPER MOTOR CONTROLLER

The integrated stepper motor controller functionality adds versatility to the IC, allowing for precise control of stepper motors.

Technical Specifications

Motion Control ICs NCV7702BDWG attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

15.395 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

7/16

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

40 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

NCV7702BDWG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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