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NCV7420D25R2G

Onsemi

NCV7420D25R2G by Onsemi

NCV7420D25R2G by Onsemi is a Line Transceiver IC with 14 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 6-26V and is suitable for automotive applications due to its small outline package style. The device features matte tin terminal finish and gull wing terminal form, making it ideal for surface mount installations.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 11,888 parts In-Stock

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Vyrian

USA . 5,744 parts In-Stock

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Digiode

USA . 1,363 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 975 parts In-Stock

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$0.730

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975

$0.730

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AZTECH Wire

Italy . 396 parts In-Stock

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$17.640

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396

$17.640

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Component Stockers USA

USA . 652 parts In-Stock

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$99.990

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652

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Kepictronics

USA . 9,500 parts In-Stock

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SupplyDigital Components

Austria . 6,834 parts In-Stock

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TANS Electronics

Latvia . 6,240 parts In-Stock

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Problanco Electronics

Mexico . 6,121 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Corphita

USA . 2,490 parts In-Stock

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Kulean Microsystems

USA . 1,163 parts In-Stock

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UHIMA Technologies

Türkiye . 387 parts In-Stock

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Corohmni

South Africa . 212 parts In-Stock

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Microchip USA

USA . 115 parts In-Stock

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Overview

Enhance your automotive electronic systems with the NCV7420D25R2G by Onsemi, a high-quality line transceiver that provides reliable communication between various devices. Designed with precision and expertise by Onsemi, this small outline package offers a wide operating temperature range and dual terminal position for maximum flexibility in your applications. Whether you're in the automotive industry or looking to upgrade your electronics, the NCV7420D25R2G delivers exceptional performance and value. Trust Onsemi to provide cutting-edge solutions for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, making the installation process more efficient.

Maximum Supply Voltage: 26 V

This high maximum supply voltage ensures compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular shape offers a compact design, saving space on the PCB.

No. of Terminals: 14

Having 14 terminals provides ample connection points for various input and output signals.

Minimum Supply Voltage: 6 V

The low minimum supply voltage ensures that the product can operate even in low power situations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the product to function in cold environments without any issues.

Terminal Finish: MATTE TIN

The matte tin finish provides good electrical conductivity and corrosion resistance.

Terminal Position: DUAL

The dual terminal position offers flexibility in wiring configurations.

Maximum Seated Height: 1.72 mm

The low seated height makes the product suitable for compact designs.

Width: 3.93 mm

The small width enables the product to fit in tight spaces on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures efficient soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable solder joints.

Length: 8.68 mm

The compact length contributes to space-saving on the PCB.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means the product meets stringent quality and reliability standards for automotive applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure solder joints.

Input Characteristics: STANDARD

Standard input characteristics make the product compatible with a wide range of input signals.

Nominal Supply Voltage: 7.3 V

The nominal supply voltage provides a stable operating voltage for the product.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting on the PCB.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates that the product has a moderate level of moisture sensitivity, making it suitable for standard handling and storage.

Interface IC Type: LINE TRANSCEIVER

The use of a line transceiver interface IC type ensures reliable communication between different systems or devices.

Technical Specifications

Line Drivers & Receivers NCV7420D25R2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.68 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Receiver No. of Bits:

1

Maximum Seated Height:

1.72 mm

Maximum Supply Voltage:

26 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

7.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.93 mm

Trade Compliance

NCV7420D25R2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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