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NCV7382DR2G

Onsemi

NCV7382DR2G by Onsemi

NCV7382DR2G by Onsemi is a Line Transceiver IC with 8 terminals, operating at -40 to 125 °C. It features Schmitt Trigger input characteristics, a max supply voltage of 5.5 V, and a transmit delay of 5000 ns. Ideal for automotive applications requiring reliable signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,082 parts In-Stock

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Digiode

USA . 1,653 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 475 parts In-Stock

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$1.070

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475

$1.070

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Corohmni

South Africa . 396 parts In-Stock

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$1.310

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396

$1.310

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AZTECH Wire

Italy . 650 parts In-Stock

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$9.690

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650

$9.690

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Continental Prestige Electronics

USA . 20,000 parts In-Stock

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$1.940

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$1.940

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TANS Electronics

Latvia . 6,981 parts In-Stock

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Microchip USA

USA . 5,576 parts In-Stock

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Kulean Microsystems

USA . 5,122 parts In-Stock

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SupplyDigital Components

Austria . 3,933 parts In-Stock

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Corphita

USA . 1,667 parts In-Stock

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Problanco Electronics

Mexico . 1,160 parts In-Stock

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Kepictronics

USA . 240 parts In-Stock

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UHIMA Technologies

Türkiye . 79 parts In-Stock

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Overview

Upgrade your line drivers and receivers with the NCV7382DR2G by Onsemi! Designed with quality in mind, this product offers reliable performance and durability. With applications in automotive systems, industrial control, and communication networks, this versatile component provides value and benefits to customers seeking seamless transmission of data. Trust in Onsemi's reputation for excellence and choose the NCV7382DR2G for all your line driver and receiver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the device, making it suitable for various environments.

Surface Mount: YES

The surface mount design allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of systems, enhancing versatility.

Package Shape: RECTANGULAR

The rectangular shape makes it easier to integrate the device into existing circuit designs, simplifying the overall layout.

Maximum Transmit Delay: 5000 ns

The low transmit delay ensures minimal signal lag, making this product ideal for applications requiring real-time data transmission.

No. of Terminals: 8

The sufficient number of terminals allows for multiple connections and interfaces, enabling versatile connectivity options.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in extreme conditions, making it suitable for outdoor or industrial applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for robust soldering during assembly, ensuring secure connections and long-term reliability.

Interface IC Type: LINE TRANSCEIVER

The use of a line transceiver interface IC ensures efficient signal transmission and reception, resulting in high-quality data communication.

Technical Specifications

Line Drivers & Receivers NCV7382DR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

6000 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

18 V

Minimum Supply Voltage-1:

7 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Transmit Delay:

5000 ns

Width:

3.9 mm

Trade Compliance

NCV7382DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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