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NCV1075P100G

Onsemi

NCV1075P100G by Onsemi

NCV1075P100G by Onsemi is a switching controller with 7 terminals, operating b/w -40 to 125 °C. It features a max switching frequency of 110 kHz and uses pulse width modulation for control. Ideal for automotive applications due to AEC-Q100 screening level.

Median Price

$5.350

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 170 parts In-Stock

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$5.350

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$2.240

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Digiode

USA . 708 parts In-Stock

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$5.082

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708

$5.082

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Vyrian

USA . 1,967 parts In-Stock

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Vigor

Singapore . 838 parts In-Stock

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$1.230

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838

$1.230

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Corphita

USA . 1,092 parts In-Stock

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$4.815

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Corohmni

South Africa . 312 parts In-Stock

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Microchip USA

USA . 1,779 parts In-Stock

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$7.992

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AZTECH Wire

Italy . 1,203 parts In-Stock

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$16.800

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Problanco Electronics

Mexico . 5,052 parts In-Stock

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Kulean Microsystems

USA . 3,038 parts In-Stock

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Perfect Parts

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SupplyDigital Components

Austria . 1,448 parts In-Stock

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TANS Electronics

Latvia . 1,078 parts In-Stock

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UHIMA Technologies

Türkiye . 365 parts In-Stock

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Authorized Procurement Solutions

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iodParts Technologies Inc.

India . 170 parts In-Stock

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Overview

Unlocking unparalleled efficiency and reliability, the NCV1075P100G by Onsemi is a game-changer in the field of Switching Regulators & Controllers. Crafted with precision and excellence, this product boasts AEC-Q100 screening level, ensuring top-notch quality for automotive applications. With its current-mode control mode and pulse width modulation technique, this switching controller offers unmatched performance while maximizing energy efficiency. Experience seamless operation and enhanced functionality with the NCV1075P100G, setting a new standard in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and heat resistance, making the product suitable for automotive applications.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality for automotive use.

Nominal Supply Voltage (Vsup): 8 V

Ideal supply voltage for automotive electronics, providing stable power to the system.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows the product to perform reliably in harsh automotive environments.

Control Mode: CURRENT-MODE

Current-mode control offers good transient response and stability for efficient power regulation.

Maximum Switching Frequency: 110 kHz

High switching frequency enables fast response times and efficient power conversion.

Technical Specifications

Switching Regulators & Controllers NCV1075P100G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

JESD-30 Code:

R-PDIP-T7

Length:

9.59 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP7/8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

5.33 mm

Maximum Supply Current (Isup):

1.3 mA

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

NO

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

110 kHz

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

NCV1075P100G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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