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NCV1070STAT3G

Onsemi

NCV1070STAT3G by Onsemi

NCV1070STAT3G by Onsemi is a switching controller with current-mode control technique. It operates in automotive applications, with a supply voltage of 8V and max operating temperature of 125 °C. This MOS technology device has a buck-boost switcher configuration and supports a max switching frequency of 71 kHz.

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1k+

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Problanco Electronics

Mexico . 6,704 parts In-Stock

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Kulean Microsystems

USA . 3,074 parts In-Stock

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SupplyDigital Components

Austria . 2,144 parts In-Stock

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Corphita

USA . 967 parts In-Stock

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TANS Electronics

Latvia . 886 parts In-Stock

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Corohmni

South Africa . 154 parts In-Stock

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UHIMA Technologies

Türkiye . 3 parts In-Stock

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Overview

Experience high-quality performance with the NCV1070STAT3G by Onsemi, a leading manufacturer in the industry of Switching Regulators & Controllers. This versatile product offers a wide range of applications and benefits, providing customers with efficient and reliable solutions. With its advanced technology and automotive-grade temperature grade, this switching controller ensures optimal performance in various environments. Trust Onsemi to deliver value and quality with the NCV1070STAT3G for all your power regulation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, making it suitable for automotive applications where weight and durability are important factors.

Surface Mount: YES

Being surface mount compatible allows for easier and more efficient assembly of the product on circuit boards, saving time and cost in manufacturing.

Screening Level: AEC-Q100

Having AEC-Q100 screening level ensures that the product meets the stringent quality standards required for automotive electronics, providing reliability and high performance in automotive applications.

Nominal Supply Voltage (Vsup): 8 V

The 8V nominal supply voltage is a common and versatile voltage level suitable for a wide range of electronic devices and systems.

No. of Terminals: 4

Having 4 terminals provides flexibility in connecting the device to the circuit, allowing for different configurations and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for applications where size constraints are a concern.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures that the product can operate reliably in challenging thermal environments, making it suitable for automotive use.

Control Mode: CURRENT-MODE

Operating in current-mode control provides fast and accurate response to load changes, improving efficiency and stability in power conversion.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the product to function in cold environments without sacrificing performance, making it suitable for automotive applications in varying climates.

Maximum Seated Height: 1.75 mm

The low seated height allows for a compact and space-efficient design, making it suitable for applications where height restrictions are a concern.

Width (mm): 3.5 mm

The narrow width of 3.5mm enables the product to fit into tight spaces, making it suitable for applications with limited space availability.

Other IC type: SWITCHING CONTROLLER

Being a switching controller provides efficient power conversion and regulation, resulting in reduced power loss and improved overall system efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds helps prevent overheating and thermal damage during the manufacturing process, ensuring product reliability.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the product can withstand high-temperature soldering processes, ensuring secure and reliable connections during assembly.

Length: 6.5 mm

The compact length of 6.5mm makes the product suitable for applications with space constraints, allowing for versatile placement on the circuit board.

Temperature Grade: AUTOMOTIVE

Having an automotive temperature grade indicates that the product is designed to meet the specific temperature requirements of automotive electronics, ensuring reliable performance in automotive applications.

Maximum Switching Frequency: 71 kHz

The high maximum switching frequency of 71kHz allows for fast and efficient power conversion, enhancing the product's performance and energy efficiency.

Maximum Supply Current (Isup): 1.3 mA

The low maximum supply current of 1.3mA helps minimize power consumption, making the product energy-efficient and suitable for battery-powered devices.

Technology: MOS

Utilizing MOS technology ensures high efficiency and fast switching speeds, resulting in improved performance and reduced power loss in power conversion.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections to the circuit board, making assembly and soldering processes more efficient and reliable.

Control Technique: PULSE WIDTH MODULATION

Operating with pulse width modulation control technique allows for accurate regulation of output voltage, improving stability and efficiency in power conversion.

Switcher Config: BUCK-BOOST

Being configured as a buck-boost switcher allows for both step-down and step-up voltage conversion, enhancing the product's versatility and applicability in various electronic devices and systems.

Terminal Pitch: 2.3 mm

The terminal pitch of 2.3mm provides sufficient spacing for connections, allowing for easy and efficient soldering and assembly processes.

Technical Specifications

Switching Regulators & Controllers NCV1070STAT3G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

JESD-30 Code:

R-PDSO-G4

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

1.3 mA

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

71 kHz

Technology:

MOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

NCV1070STAT3G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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