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NCV1060BD060R2G

Onsemi

NCV1060BD060R2G by Onsemi

NCV1060BD060R2G by Onsemi is a switching controller with 16 terminals and a max output current of 0.52A. Operating temperature ranges from -40 to 125 °C, making it suitable for automotive applications. It utilizes pulse width modulation control technique and has a buck-boost switcher configuration with a nominal input voltage of 14V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,182 parts In-Stock

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Digiode

USA . 228 parts In-Stock

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Vigor

Singapore . 942 parts In-Stock

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$0.650

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942

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Microchip USA

USA . 4,639 parts In-Stock

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$4.671

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AZTECH Wire

Italy . 431 parts In-Stock

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$16.634

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$16.468

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$15.802

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50

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Problanco Electronics

Mexico . 5,693 parts In-Stock

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SupplyDigital Components

Austria . 3,021 parts In-Stock

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Authorized Procurement Solutions

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iodParts Technologies Inc.

India . 2,491 parts In-Stock

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Corphita

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Kulean Microsystems

USA . 1,715 parts In-Stock

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TANS Electronics

Latvia . 1,048 parts In-Stock

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UHIMA Technologies

Türkiye . 850 parts In-Stock

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Corohmni

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Overview

Elevate your power management solutions with the NCV1060BD060R2G by Onsemi. This high-quality switching regulator offers unparalleled efficiency and reliability in a compact package. Designed for automotive applications, this switching controller provides optimal performance in challenging environments. With current-mode control and pulse width modulation techniques, this product ensures precise voltage regulation and energy conservation. Trust Onsemi's expertise in semiconductor manufacturing to deliver cutting-edge technology that enhances your systems' performance and longevity. Experience the difference with the NCV1060BD060R2G and elevate your power management capabilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

Surface mount design makes installation easy and saves space on the PCB.

Nominal Supply Voltage (Vsup): 14 V

Suitable for applications requiring a 14V power supply, providing compatibility with a wide range of systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Maximum Output Current: 0.52 A

Capable of delivering up to 0.52A output current, suitable for powering various devices.

Technical Specifications

Switching Regulators & Controllers NCV1060BD060R2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

14 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.52 A

Nominal Output Voltage:

9 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

66 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCV1060BD060R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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