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NCV1070P065G

Onsemi

NCV1070P065G by Onsemi

NCV1070P065G by Onsemi is a switching controller with current-mode control technique. It operates in automotive temperature grade range from -40 to 125 °C, suitable for AEC-Q100 screening level applications. With a max switching frequency of 71 kHz and buck-boost switcher configuration, it offers efficient power management in compact IN-LINE package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,439 parts In-Stock

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Digiode

USA . 1,268 parts In-Stock

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SupplyDigital Components

Austria . 7,707 parts In-Stock

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Kulean Microsystems

USA . 6,117 parts In-Stock

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Problanco Electronics

Mexico . 4,495 parts In-Stock

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Corphita

USA . 1,530 parts In-Stock

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TANS Electronics

Latvia . 687 parts In-Stock

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Corohmni

South Africa . 442 parts In-Stock

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UHIMA Technologies

Türkiye . 5 parts In-Stock

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Overview

Enhance your automotive electronic designs with the NCV1070P065G by Onsemi. This switching regulator/controller offers exceptional quality and reliability, meeting AEC-Q100 screening standards. With a compact package design and versatile control mode options, this product is perfect for a wide range of applications in the automotive industry. Experience the benefits of efficient power management and precise voltage regulation, all while enjoying the peace of mind that comes with using a trusted manufacturer like Onsemi. Upgrade your projects today with the NCV1070P065G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for automotive applications where ruggedness is required.

Nominal Supply Voltage (Vsup): 8 V

Operating at 8V nominal supply voltage allows for compatibility with a wide range of electronic systems and devices.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, the product can withstand high heat environments common in automotive and industrial applications.

Control Mode: CURRENT-MODE

Current-mode control offers better transient response and improved noise immunity, enhancing overall performance of the switching regulator.

Technology: MOS

MOS technology ensures efficient power conversion and reduced power losses, leading to better energy efficiency and longer battery life in portable devices.

Switcher Config: BUCK-BOOST

The buck-boost configuration allows for both step-up and step-down voltage regulation, providing flexibility in power supply design.

Technical Specifications

Switching Regulators & Controllers NCV1070P065G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

JESD-30 Code:

R-PDIP-T7

Length:

9.59 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP7/8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

5.33 mm

Maximum Supply Current (Isup):

1.3 mA

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

NO

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

71 kHz

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

NCV1070P065G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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