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NCP4354BDR2G

Onsemi

NCP4354BDR2G by Onsemi

NCP4354BDR2G by Onsemi is a Power Management IC with 8 terminals, Vsup range of 2.5V to 36V, and adjustable threshold. It is a surface-mount device in a small outline package suitable for power supply support circuits. Operating temperature ranges from 0 °C to 125°C making it ideal for various electronic applications.

Median Price

$0.371

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,763 parts In-Stock

1+ parts

-

100+ parts

$0.357

1k+ parts

$0.296

10k+ parts

$0.264

1,763

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$0.357

$0.296

$0.264

Farnell

UK . 1,763 parts In-Stock

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$0.371

1,763

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$0.371

Verical

USA . 1,564 parts In-Stock

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$0.401

10k+ parts

$0.370

1,564

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$0.401

$0.370

Distributors (In-Stock)

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Digiode

USA . 334 parts In-Stock

1+ parts

$0.277

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334

$0.277

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Vyrian

USA . 7,436 parts In-Stock

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7,436

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Bristol Electronics

USA . 4,925 parts In-Stock

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Dan-Mar Components

USA . 4,925 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,436 parts In-Stock

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2,436

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Distributors (Availability)

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Corphita

USA . 970 parts In-Stock

1+ parts

$0.263

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970

$0.263

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Vigor

Singapore . 168 parts In-Stock

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$0.280

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168

$0.280

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Corohmni

South Africa . 305 parts In-Stock

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$0.292

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305

$0.292

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AZTECH Wire

Italy . 253 parts In-Stock

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$12.020

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253

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Kulean Microsystems

USA . 7,470 parts In-Stock

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7,470

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SupplyDigital Components

Austria . 2,593 parts In-Stock

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Continental Prestige Electronics

USA . 1,763 parts In-Stock

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$0.240

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1,763

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UHIMA Technologies

Türkiye . 732 parts In-Stock

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732

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TANS Electronics

Latvia . 612 parts In-Stock

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612

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Microchip USA

USA . 381 parts In-Stock

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Problanco Electronics

Mexico . 16 parts In-Stock

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Overview

Looking for a reliable power management solution? Look no further than the NCP4354BDR2G by Onsemi. With its high-quality manufacturing and small outline package style, this Power Management IC is perfect for a wide range of applications. From adjustable thresholds to a wide supply voltage range, this product offers exceptional value and benefits to customers looking for efficiency and performance in their devices. Trust Onsemi to deliver the quality you need for your power supply support circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring a long lifespan for the Power Management IC.

Surface Mount: YES

This allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 15 V

This voltage level is suitable for a wide range of applications, making this Power Management IC versatile in various electronic devices.

No. of Terminals: 8

With 8 terminals, this IC can handle multiple connections and functions, increasing its capabilities in power management tasks.

Maximum Operating Temperature: 125 °C

This high operating temperature range ensures the IC can perform reliably even in challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The low operating temperature threshold allows the IC to function in cold environments without any performance issues.

Maximum Seated Height: 1.75 mm

The compact size of this IC with a low seated height makes it suitable for space-constrained applications where size matters.

Maximum Supply Voltage (Vsup): 36 V

This high voltage tolerance enables the IC to handle varying input voltages, making it a reliable choice for power management tasks in different electronic systems.

Technical Specifications

Power Management ICs NCP4354BDR2G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NCP4354BDR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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