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NCP348MTTXG

Onsemi

NCP348MTTXG by Onsemi

NCP348MTTXG by Onsemi is a MOSFET gate driver with 10 terminals, suitable for industrial applications. It operates b/w -40 to 85 °C and supports a supply voltage range of 1.2-28 V. This small outline driver has a peak reflow temperature of 260 °C, making it ideal for high side driving in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,097 parts In-Stock

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11,097

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Digiode

USA . 638 parts In-Stock

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638

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Distributors (Availability)

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AZTECH Wire

Italy . 1,085 parts In-Stock

1+ parts

$21.200

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1,085

$21.200

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Problanco Electronics

Mexico . 5,795 parts In-Stock

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5,795

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Kulean Microsystems

USA . 2,499 parts In-Stock

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2,499

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TANS Electronics

Latvia . 2,154 parts In-Stock

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2,154

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Corphita

USA . 1,269 parts In-Stock

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1,269

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SupplyDigital Components

Austria . 834 parts In-Stock

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834

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UHIMA Technologies

Türkiye . 474 parts In-Stock

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Corohmni

South Africa . 413 parts In-Stock

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Overview

Unleash the power of your electronics with the NCP348MTTXG by Onsemi! This high-quality MOSFET Gate Driver is designed to maximize performance and efficiency in a variety of applications. With a wide operating temperature range and low supply voltage requirements, this product offers unmatched reliability and flexibility. Whether you're working on industrial automation, motor control, or power management projects, the NCP348MTTXG delivers the value, benefits, and advantages you need to take your designs to the next level. Trust Onsemi for cutting-edge technology that empowers your innovation.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 28 V

Ability to handle a high maximum supply voltage makes this driver suitable for a wide range of applications requiring higher voltage operation.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enables compact designs and efficient heat dissipation, especially important for applications with space constraints.

Minimum Supply Voltage: 1.2 V

Low minimum supply voltage allows for operation in systems where power efficiency is crucial, while still providing the necessary driving capabilities.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this driver can withstand demanding environmental conditions and ensure reliable performance even in harsh industrial settings.

Temperature Grade: INDUSTRIAL

Being industrial-grade means that this driver is built to meet stringent reliability and durability standards, making it suitable for use in industrial applications where performance under challenging conditions is key.

Technical Specifications

MOSFET Gate Drivers NCP348MTTXG attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-XDSO-N10

JESD-609 Code:

e3

Length:

2.5 mm

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

NCP348MTTXG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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