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NCP305LSQ25T1G

Onsemi

NCP305LSQ25T1G by Onsemi

NCP305LSQ25T1G by Onsemi is a Power Management IC with 0.8-10V power supplies, -40 to 85 °C operating temp range, and 4 terminals in a small outline package. Ideal for industrial applications requiring power supply support circuits with a compact design and surface-mount capability.

Median Price

$0.232

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 286,190 parts In-Stock

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-

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$0.241

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$0.200

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$0.178

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$0.241

$0.200

$0.178

Verical

USA . 205,190 parts In-Stock

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$0.223

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$0.223

Flip Electronics (Authorized)

USA . 92,781 parts In-Stock

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92,781

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Flip Electronics

USA . 92,781 parts In-Stock

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Vyrian

USA . 2,224 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,021 parts In-Stock

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Bristol Electronics

USA . 1,021 parts In-Stock

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Dan-Mar Components

USA . 1,021 parts In-Stock

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Digiode

USA . 123 parts In-Stock

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Ampacity Inc.

Singapore . 69,364 parts In-Stock

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$0.168

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$0.168

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Vigor

Singapore . 409 parts In-Stock

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$0.190

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Corohmni

South Africa . 123 parts In-Stock

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$0.289

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AZTECH Wire

Italy . 905 parts In-Stock

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$9.990

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$9.990

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Kepictronics

USA . 30,000 parts In-Stock

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TANS Electronics

Latvia . 7,244 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 6,114 parts In-Stock

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Problanco Electronics

Mexico . 5,097 parts In-Stock

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Perfect Parts

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SupplyDigital Components

Austria . 1,551 parts In-Stock

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Assy Fe

Spain . 1,370 parts In-Stock

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UHIMA Technologies

Türkiye . 974 parts In-Stock

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Continental Prestige Electronics

USA . 700 parts In-Stock

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Corphita

USA . 407 parts In-Stock

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Microchip USA

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Overview

Experience the cutting-edge technology of Onsemi with the NCP305LSQ25T1G power management IC. Designed for industrial applications, this small outline, thin profile package offers a wide operating temperature range and dual terminal position for maximum flexibility. With a nominal threshold voltage of +2.5V and a minimum supply voltage of 0.8V, this power supply support circuit provides reliable performance in a compact form factor. Trust Onsemi for quality and innovation in power management ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and protection for the internal components of the IC.

Surface Mount: YES

Surface mount design allows for easy and convenient installation onto PCBs.

Power Supplies (V): 0.8/10

Wide range of power supply voltages supported, making it versatile for different applications.

No. of Terminals: 4

Simplified design with a small number of terminals for easier integration into circuits.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance even in extreme conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in both hot and cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and corrosion resistance for the terminals.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and design.

Width (mm): 1.25 mm

Compact width allows for space-saving installation in tight layouts.

Temperature Grade: INDUSTRIAL

Industrial grade temperature rating ensures reliable performance in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Maximum Supply Voltage (Vsup): 10 V

High maximum supply voltage allows for compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs NCP305LSQ25T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.5V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0033 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.5V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

NCP305LSQ25T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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