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NCP304LSQ47T1

Onsemi

NCP304LSQ47T1 by Onsemi

NCP304LSQ47T1 by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for industrial applications. It features a small outline package style, CMOS technology, and operates b/w -40 °C to 85°C. This IC has dual terminals with tin lead finish and is designed for power supply support circuits in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,660 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 1,023 parts In-Stock

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$12.890

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Kepictronics

USA . 23,260 parts In-Stock

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Kulean Microsystems

USA . 5,008 parts In-Stock

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TANS Electronics

Latvia . 4,251 parts In-Stock

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Assy Fe

Spain . 2,050 parts In-Stock

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Corphita

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Vigor

Singapore . 838 parts In-Stock

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UHIMA Technologies

Türkiye . 751 parts In-Stock

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Problanco Electronics

Mexico . 389 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 328 parts In-Stock

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SupplyDigital Components

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Overview

Unlock the power of efficient and reliable power management with the NCP304LSQ47T1 by Onsemi. Crafted with precision and innovation, this Power Management IC is designed to meet the highest standards of quality and performance. Ideal for industrial applications, this small outline, thin profile package offers a wide range of benefits, including optimal supply voltage, minimal supply current, and a durable design that can withstand extreme temperatures. Trust Onsemi to deliver cutting-edge technology that enhances your projects with superior efficiency and reliability. Elevate your power management solutions with the NCP304LSQ47T1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the power management IC.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and making assembly more efficient.

Nominal Supply Voltage (Vsup): 1.5 V

Suitable for low power applications and helps in efficient power management.

Power Supplies (V): 0.8/10

Wide range of power supplies supported, making it versatile for different applications.

Maximum Operating Temperature: 85 °C

Can operate reliably in high temperature environments, increasing its usability.

Minimum Operating Temperature: -40 °C

Can operate in low temperature conditions, making it suitable for a wide range of environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the power management IC.

Technical Specifications

Power Management ICs NCP304LSQ47T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 4.7V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Length:

2 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0039 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.7V

Width (mm):

1.25 mm

Trade Compliance

NCP304LSQ47T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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