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NCP304LSQ42T1

Onsemi

NCP304LSQ42T1 by Onsemi

NCP304LSQ42T1 by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for industrial applications. It features a small outline package with dual terminals and operates b/w -40 °C to 85°C. The CMOS technology IC has a peak reflow temperature of 235°C and low supply current of 0.0036mA.

Median Price

$0.216

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

24,000

-

$0.225

$0.186

$0.166

Verical

USA . 24,000 parts In-Stock

1+ parts

-

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$0.208

24,000

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-

-

$0.208

Distributors (In-Stock)

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Digiode

USA . 92 parts In-Stock

1+ parts

$0.175

100+ parts

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92

$0.175

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PC Components Company LLC

USA . 27,000 parts In-Stock

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27,000

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Bristol Electronics

USA . 24,000 parts In-Stock

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24,000

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Vyrian

USA . 2,555 parts In-Stock

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2,555

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Distributors (Availability)

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Corohmni

South Africa . 112 parts In-Stock

1+ parts

$0.160

100+ parts

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112

$0.160

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Corphita

USA . 2,373 parts In-Stock

1+ parts

$0.166

100+ parts

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2,373

$0.166

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Vigor

Singapore . 825 parts In-Stock

1+ parts

$0.180

100+ parts

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825

$0.180

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AZTECH Wire

Italy . 205 parts In-Stock

1+ parts

$14.370

100+ parts

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205

$14.370

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$21.686

100+ parts

$19.734

1k+ parts

$17.783

10k+ parts

-

3,000

$21.686

$19.734

$17.783

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Continental Prestige Electronics

USA . 24,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.160

10k+ parts

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24,000

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$0.160

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SupplyDigital Components

Austria . 7,773 parts In-Stock

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7,773

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Kulean Microsystems

USA . 4,283 parts In-Stock

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4,283

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TANS Electronics

Latvia . 3,380 parts In-Stock

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3,380

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Problanco Electronics

Mexico . 2,260 parts In-Stock

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2,260

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UHIMA Technologies

Türkiye . 953 parts In-Stock

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953

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Microchip USA

USA . 423 parts In-Stock

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423

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Overview

Discover the NCP304LSQ42T1 by Onsemi, a cutting-edge Power Management IC designed to optimize power supplies with a nominal supply voltage of 1.5V. Onsemi's reputation for quality shines through in this small outline, thin profile package, making it ideal for industrial applications. With a wide operating temperature range and advanced CMOS technology, this IC offers customers reliability and efficiency like never before. Experience the benefits of enhanced power supply support circuitry with the NCP304LSQ42T1 - a game changer in power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and reliability for the package, ensuring long-term performance of the Power Management IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 1.5 V

A nominal supply voltage of 1.5V makes this Power Management IC compatible with a wide range of applications, providing versatility in usage.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this Power Management IC can withstand challenging environmental conditions, increasing its reliability and lifespan.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making this Power Management IC efficient and reliable in operation.

Technical Specifications

Power Management ICs NCP304LSQ42T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 4.2V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Length:

2 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0036 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.2V

Width (mm):

1.25 mm

Trade Compliance

NCP304LSQ42T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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