Loading...

NCP1852AFCCT1G

Onsemi

NCP1852AFCCT1G by Onsemi

NCP1852AFCCT1G by Onsemi is a Power Management IC with 25 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 85 °C, with supply voltages of 3.6/7V and max current of 1500mA. Ideal for industrial applications requiring POWER SUPPLY MANAGEMENT CIRCUITS.

Median Price

$0.938

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,083,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.632

1,083,000

-

-

-

$0.632

Rochester

USA . 1,044,000 parts In-Stock

1+ parts

-

100+ parts

$0.938

1k+ parts

$0.778

10k+ parts

$0.694

1,044,000

-

$0.938

$0.778

$0.694

Verical

USA . 774,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.973

10k+ parts

$0.868

774,000

-

-

$0.973

$0.868

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,165 parts In-Stock

1+ parts

$0.731

100+ parts

-

1k+ parts

-

10k+ parts

-

1,165

$0.731

-

-

-

Vyrian

USA . 7,531 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,531

-

-

-

-

Speed Components Ltd

Israel . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 381 parts In-Stock

1+ parts

$0.632

100+ parts

-

1k+ parts

-

10k+ parts

-

381

$0.632

-

-

-

Corphita

USA . 2,462 parts In-Stock

1+ parts

$0.692

100+ parts

-

1k+ parts

-

10k+ parts

-

2,462

$0.692

-

-

-

Vigor

Singapore . 186 parts In-Stock

1+ parts

$0.740

100+ parts

-

1k+ parts

-

10k+ parts

-

186

$0.740

-

-

-

AZTECH Wire

Italy . 856 parts In-Stock

1+ parts

$21.020

100+ parts

-

1k+ parts

-

10k+ parts

-

856

$21.020

-

-

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$25.494

100+ parts

$23.200

1k+ parts

$20.905

10k+ parts

-

2,000

$25.494

$23.200

$20.905

-

Continental Prestige Electronics

USA . 1,044,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.609

10k+ parts

-

1,044,000

-

-

$0.609

-

Kulean Microsystems

USA . 7,774 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,774

-

-

-

-

SupplyDigital Components

Austria . 6,659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,659

-

-

-

-

TANS Electronics

Latvia . 6,641 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,641

-

-

-

-

Problanco Electronics

Mexico . 603 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

603

-

-

-

-

UHIMA Technologies

Türkiye . 468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

468

-

-

-

-

Microchip USA

USA . 371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

371

-

-

-

-

Overview

Discover the NCP1852AFCCT1G by Onsemi, a cutting-edge Power Management IC that combines quality and innovation for superior performance. With its advanced design and reliable manufacturer, this product is ideal for a wide range of applications. From industrial to consumer electronics, this power management circuit offers customers unparalleled value, efficiency, and flexibility. Trust Onsemi's expertise to deliver top-notch products that meet your power supply needs with precision and reliability. Experience the difference with the NCP1852AFCCT1G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material offers durability and protection for the internal components, making the product long-lasting and reliable.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving space and enabling efficient production processes.

Package Shape: SQUARE

The square package shape aids in uniform heating and cooling, improving overall performance and reliability of the product.

Power Supplies (V): 3.6/7

The ability to handle power supplies of 3.6V and 7V provides flexibility and compatibility with a wide range of devices and applications.

No. of Terminals: 25

The 25 terminals offer multiple connection points for various inputs and outputs, allowing for complex power management functions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures the product can perform reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the product can operate effectively in extreme cold conditions.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, this product is designed to efficiently regulate and control power, enhancing the performance and stability of the connected system.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that the product is rugged and reliable, suitable for use in harsh industrial settings.

Maximum Supply Current (Isup): 1500 mA

With a maximum supply current of 1500mA, this product can efficiently handle high power loads, making it suitable for various power-hungry applications.

Terminal Form: BALL

The ball terminal form offers reliable connections and facilitates easy soldering onto the PCB, ensuring stable and secure electrical connections.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4mm allows for dense packing of components on the PCB, enabling compact and efficient circuit designs.

Technical Specifications

Power Management ICs NCP1852AFCCT1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

S-PBGA-B25

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.6/7

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1500 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

NCP1852AFCCT1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20