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NC7NZ17L8X

Onsemi

NC7NZ17L8X by Onsemi

The Onsemi NC7NZ17L8X is a CMOS logic gate with 3 functions, 7.3ns propagation delay at 1.8V, and 50pF load capacitance. Ideal for industrial applications requiring Schmitt trigger functionality in a compact square chip carrier package. Operating temperature range from -40 to 85°C makes it suitable for various environments.

Median Price

$0.224

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 8,266 parts In-Stock

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$0.300

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$0.160

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$0.134

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$0.120

8,266

$0.300

$0.160

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$0.120

Mouser Electronics

USA . 3,300 parts In-Stock

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$0.300

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$0.161

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$0.135

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$0.123

3,300

$0.300

$0.161

$0.135

$0.123

Avnet

USA . 10,000 parts In-Stock

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Arrow

USA . 5,000 parts In-Stock

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$0.116

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Verical

USA . 5,000 parts In-Stock

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$0.116

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Farnell

UK . 3,685 parts In-Stock

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$0.514

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$0.355

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3,685

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Rochester

USA . 79 parts In-Stock

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$0.147

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$0.122

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$0.108

79

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Distributors (In-Stock)

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Digiode

USA . 1,904 parts In-Stock

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$0.114

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Nova Conductors

Japan . 550 parts In-Stock

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$0.314

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$0.314

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NAC Semi

USA . 30,000 parts In-Stock

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Chip Stock

USA . 6,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 4,990 parts In-Stock

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Vyrian

USA . 3,289 parts In-Stock

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Flip Electronics

USA . 2,247 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 87 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,178 parts In-Stock

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$0.102

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$0.102

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Semicontronic

India . 1,462 parts In-Stock

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$0.102

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$0.099

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$0.099

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1,462

$0.102

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$0.099

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Corphita

USA . 508 parts In-Stock

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$0.108

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508

$0.108

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Corohmni

South Africa . 486 parts In-Stock

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$0.120

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$0.120

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Continental Prestige Electronics

USA . 4,990 parts In-Stock

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$0.130

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$0.130

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Argo Parts USA

USA . 3,689 parts In-Stock

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$0.314

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$0.305

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$0.314

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Microchip USA

USA . 117 parts In-Stock

1+ parts

$1.370

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$1.360

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$1.360

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$1.350

117

$1.370

$1.360

$1.360

$1.350

Aztec Data Supply Inc.

USA . 4,643 parts In-Stock

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$13.853

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RC Electronics

USA . 93,063 parts In-Stock

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$0.320

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$0.290

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$0.280

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$0.280

QUARKTWIN TECHNOLOGY LTD

USA . 24,188 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 7,506 parts In-Stock

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SupplyDigital Components

Austria . 6,820 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,555 parts In-Stock

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Perfect Parts

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Kepictronics

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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iodParts Technologies Inc.

India . 4,460 parts In-Stock

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$0.318

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Speed Components Ltd (Excess)

Israel . 3,703 parts In-Stock

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TANS Electronics

Latvia . 3,410 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Problanco Electronics

Mexico . 991 parts In-Stock

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UHIMA Technologies

Türkiye . 881 parts In-Stock

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Supply Digital

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Futuretech Components

Singapore . 400 parts In-Stock

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Overview

Experience the next level of performance with the NC7NZ17L8X by Onsemi. This logic gate offers unparalleled speed and reliability, thanks to Onsemi's reputation for high-quality manufacturing. Ideal for a wide range of applications, this chip carrier package boasts a low propagation delay and surface mount capability, making it an essential component for any industrial project. Trust Onsemi to deliver cutting-edge technology that exceeds expectations and unlocks new possibilities for your designs.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 7.3 ns

Low propagation delay ensures fast response times in logic operations.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards.

No. of Functions: 3

Multiple functions in a single component provide versatility and flexibility in circuit design.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, making it energy-efficient and suitable for low-power applications.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compact size and efficient heat dissipation.

Maximum I (ol): 24 Amp

High output current capability allows for driving of larger loads in the circuit.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments.

Schmitt Trigger: YES

Schmitt trigger feature provides hysteresis and noise immunity for more stable circuit operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Logic Gates NC7NZ17L8X attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-XQCC-N8

JESD-609 Code:

e4

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.3 ns

Propagation Delay (tpd):

13.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

NC7NZ17L8X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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