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NC7NZ04L8X

Onsemi

NC7NZ04L8X by Onsemi

The Onsemi NC7NZ04L8X is a CMOS Logic Gates chip with 3 functions, 5ns propagation delay at 1.8V. Ideal for industrial applications, it operates b/w -40 to 85°C and supports a supply voltage range of 1.65-5.5V, making it suitable for various electronic systems requiring fast signal processing.

Median Price

$0.206

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6,003 parts In-Stock

1+ parts

$0.300

100+ parts

$0.161

1k+ parts

$0.135

10k+ parts

$0.123

6,003

$0.300

$0.161

$0.135

$0.123

DigiKey

USA . 4,500 parts In-Stock

1+ parts

$0.300

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$0.160

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$0.134

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$0.120

4,500

$0.300

$0.160

$0.134

$0.120

Rochester

USA . 17,397 parts In-Stock

1+ parts

$0.320

100+ parts

$0.310

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$0.310

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17,397

$0.320

$0.310

$0.310

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Chip1Stop

Japan . 7,346 parts In-Stock

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$0.109

7,346

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$0.109

Arrow

USA . 5,000 parts In-Stock

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$0.112

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Verical

USA . 5,000 parts In-Stock

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$0.112

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$0.112

Distributors (In-Stock)

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Flip Electronics

USA . 39,448 parts In-Stock

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Chip Stock

USA . 28,500 parts In-Stock

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IBS Electronics

USA . 20,000 parts In-Stock

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$0.106

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$0.106

Vyrian

USA . 9,192 parts In-Stock

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Bristol Electronics

USA . 4,559 parts In-Stock

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Digiode

USA . 2,536 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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North Shore Components

USA . 13 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 9,495 parts In-Stock

1+ parts

$0.093

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$0.093

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Corohmni

South Africa . 103 parts In-Stock

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$0.109

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103

$0.109

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Semicontronic

India . 9,534 parts In-Stock

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$0.202

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$0.197

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$0.196

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9,534

$0.202

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$0.196

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Kepictronics

USA . 30,000 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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SupplyDigital Components

Austria . 7,647 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,541 parts In-Stock

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Kulean Microsystems

USA . 6,787 parts In-Stock

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Lixinc

USA . 6,677 parts In-Stock

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Problanco Electronics

Mexico . 6,225 parts In-Stock

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Continental Prestige Electronics

USA . 5,769 parts In-Stock

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Perfect Parts

USA . 5,554 parts In-Stock

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TANS Electronics

Latvia . 2,624 parts In-Stock

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Argo Parts USA

USA . 2,601 parts In-Stock

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Supply Digital

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Corphita

USA . 1,716 parts In-Stock

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UHIMA Technologies

Türkiye . 723 parts In-Stock

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Microchip USA

USA . 487 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Overview

Experience high-quality performance and reliability with the NC7NZ04L8X logic gates by Onsemi. Designed with precision and expertise, this product offers fast propagation delay and low power consumption, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this versatile chip carrier is sure to meet your needs. With its innovative technology and durable construction, Onsemi's NC7NZ04L8X provides exceptional value and efficiency, ensuring smooth operation and seamless integration. Upgrade your systems today with the superior capabilities of this logic gate from a trusted manufacturer.

Feature Benefit Bullets

Propagation Delay At Nominal Supply

Low propagation delay allows for high-speed signal processing, making this product suitable for applications requiring quick response times.

Surface Mount

Surface mount technology enables easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Functions

Having multiple functions packed into one component reduces the need for additional chips, saving space and simplifying circuit designs.

Nominal Supply Voltage / Vsup (V)

Operates at a low nominal supply voltage, making it energy-efficient and suitable for applications where power consumption is a concern.

Maximum Operating Temperature

Capable of operating at high temperatures, making it suitable for industrial environments or applications where heat management is crucial.

Technical Specifications

Logic Gates NC7NZ04L8X attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-XQCC-N8

JESD-609 Code:

e4

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

NC7NZ04L8X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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