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NB7V33MMNHTBG

Onsemi

NB7V33MMNHTBG by Onsemi

NB7V33MMNHTBG clock driver by Onsemi operates at 1.8/2.5V, with a propagation delay of 0.7ns and max frequency of 10GHz. Ideal for industrial applications requiring differential input conditioning, it comes in a square chip carrier package with 16 terminals.

Median Price

$10.408

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 27 parts In-Stock

1+ parts

$16.650

100+ parts

$9.330

1k+ parts

$8.910

10k+ parts

-

27

$16.650

$9.330

$8.910

-

Rochester

USA . 8,551 parts In-Stock

1+ parts

-

100+ parts

$8.110

1k+ parts

$7.260

10k+ parts

$6.830

8,551

-

$8.110

$7.260

$6.830

DigiKey

USA . 8,551 parts In-Stock

1+ parts

-

100+ parts

$10.680

1k+ parts

-

10k+ parts

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8,551

-

$10.680

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Verical

USA . 8,551 parts In-Stock

1+ parts

-

100+ parts

$10.137

1k+ parts

$9.075

10k+ parts

-

8,551

-

$10.137

$9.075

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,452 parts In-Stock

1+ parts

$8.560

100+ parts

-

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2,452

$8.560

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Vyrian

USA . 2,106 parts In-Stock

1+ parts

$9.010

100+ parts

-

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2,106

$9.010

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-

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Flip Electronics

USA . 1,300 parts In-Stock

1+ parts

-

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1,300

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-

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North Shore Components

USA . 202 parts In-Stock

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202

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Inventory MP

USA . 8 parts In-Stock

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8

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Bristol Electronics

USA . 8 parts In-Stock

1+ parts

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,345 parts In-Stock

1+ parts

$8.109

100+ parts

-

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1,345

$8.109

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Corohmni

South Africa . 384 parts In-Stock

1+ parts

$9.370

100+ parts

-

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384

$9.370

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Microchip USA

USA . 2,365 parts In-Stock

1+ parts

$31.398

100+ parts

-

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10k+ parts

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2,365

$31.398

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TANS Electronics

Latvia . 5,951 parts In-Stock

1+ parts

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5,951

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Problanco Electronics

Mexico . 5,295 parts In-Stock

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5,295

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Kulean Microsystems

USA . 2,290 parts In-Stock

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2,290

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SupplyDigital Components

Austria . 2,169 parts In-Stock

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2,169

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UHIMA Technologies

Türkiye . 971 parts In-Stock

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971

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Perfect Parts

USA . 84 parts In-Stock

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84

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Overview

Experience unrivaled performance and reliability with the NB7V33MMNHTBG clock driver by Onsemi. As a leader in clock drivers & buffers, Onsemi ensures top-notch quality and cutting-edge technology in every product. Perfect for applications requiring differential input conditioning, this surface-mount chip carrier offers a nominal supply voltage of 1.8V and a maximum operating temperature of 85 °C. With a propagation delay of just 0.7ns, customers can trust that their systems will run smoothly and efficiently. Upgrade your designs today with the NB7V33MMNHTBG and enjoy the superior value and benefits it brings to your projects.

Feature Benefit Bullets

Surface Mount: YES

Being surface mount allows for easy and efficient PCB integration, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps improve signal quality and reduce noise, making this product suitable for sensitive clock applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal supply voltage of 1.8V allows for compatibility with a wide range of systems and low power consumption.

Propagation Delay (tpd): 0.7 ns

The low propagation delay ensures fast and efficient clock signal delivery, making this product ideal for high-speed applications.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade range of -40 to 85 °C, this product is highly reliable and suitable for various industrial environments.

Technical Specifications

Clock Drivers & Buffers NB7V33MMNHTBG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT 2.5V SUPPLY

Family:

7V

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

10000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5

Maximum Power Supply Current (ICC):

115 mA

Propagation Delay (tpd):

.7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB7V33MMNHTBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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