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NB7V32MMNG

Onsemi

NB7V32MMNG by Onsemi

NB7V32MMNG clock driver by Onsemi features a 16-terminal chip carrier package with a propagation delay of 0.275 ns. Operating at an industrial temperature range from -40 to 85 °C, it supports a max frequency of 10 GHz. Ideal for applications requiring differential input conditioning and a nominal voltage of 1.8 V.

Median Price

$684.500

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 1,810 parts In-Stock

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$684.500

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$684.500

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1,810

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$684.500

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$684.500

Flip Electronics (Authorized)

USA . 1,810 parts In-Stock

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Digiode

USA . 337 parts In-Stock

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$650.275

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Vyrian

USA . 1,453 parts In-Stock

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Flip Electronics

USA . 1,810 parts In-Stock

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Semtec, LLC

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Elcom Components

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Corphita

USA . 2,023 parts In-Stock

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$616.050

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Corohmni

South Africa . 427 parts In-Stock

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$684.500

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SupplyDigital Components

Austria . 7,826 parts In-Stock

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Kulean Microsystems

USA . 6,634 parts In-Stock

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Problanco Electronics

Mexico . 6,472 parts In-Stock

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Component Stockers USA

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TANS Electronics

Latvia . 710 parts In-Stock

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UHIMA Technologies

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Perfect Parts

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Microchip USA

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Overview

Looking for a high-quality clock driver and buffer that delivers exceptional performance? Look no further than the NB7V32MMNG by Onsemi. With its differential input conditioning and industrial-grade temperature range, this chip carrier with a heat sink profile is perfect for a wide range of applications. From data centers to telecommunications equipment, this versatile product offers reliable operation and fast propagation delay, making it a valuable addition to any electronic design. Upgrade your project with the NB7V32MMNG and experience the benefits of Onsemi's top-notch manufacturing expertise.

Feature Benefit Bullets

Surface Mount - YES

Being surface mount allows for easy and convenient installation on PCBs, saving space and improving efficiency in circuit design.

Input Conditioning - DIFFERENTIAL

Differential input conditioning ensures accurate signal processing and noise immunity, making the product suitable for high-performance applications.

Nominal Supply Voltage / Vsup (V) - 1.8

Operates at a common and stable supply voltage, ensuring compatibility with a wide range of systems and devices.

Propagation Delay (tpd) - 0.275 ns

Low propagation delay ensures fast and efficient signal transmission, making the product suitable for high-speed applications.

Maximum Operating Temperature - 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions, increasing reliability.

Minimum Operating Temperature -40 °C

Wide temperature range allows the product to operate in extreme cold conditions, making it versatile and suitable for various environments.

Maximum Frequency At Nominal Supply - 10000000000 Hz

Supports high-frequency operation, making it ideal for high-speed clock driving applications.

Technical Specifications

Clock Drivers & Buffers NB7V32MMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT 2.5V SUPPLY

Family:

7V

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

10000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay (tpd):

.275 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB7V32MMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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