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NB7VQ14MMNHTBG

Onsemi

NB7VQ14MMNHTBG by Onsemi

NB7VQ14MMNHTBG clock driver by Onsemi features a low propagation delay of 0.225 ns, suitable for high-speed applications up to 7000 MHz. With differential mux input conditioning and 8 true outputs, it operates at a nominal voltage of 1.8 V in industrial temperature grades.

Median Price

$11.300

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 481 parts In-Stock

1+ parts

$11.300

100+ parts

$7.571

1k+ parts

$6.898

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481

$11.300

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$6.898

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Mouser Electronics

USA . 300 parts In-Stock

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$11.300

100+ parts

$7.340

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$6.590

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300

$11.300

$7.340

$6.590

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Verical

USA . 700 parts In-Stock

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$6.350

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700

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$6.350

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Distributors (In-Stock)

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Digiode

USA . 1,694 parts In-Stock

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$12.074

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1,694

$12.074

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Vyrian

USA . 7,940 parts In-Stock

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Flip Electronics

USA . 700 parts In-Stock

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700

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Sensible Micro Corp

USA . 198 parts In-Stock

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198

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Distributors (Availability)

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Corphita

USA . 2,118 parts In-Stock

1+ parts

$11.439

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2,118

$11.439

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Corohmni

South Africa . 440 parts In-Stock

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$12.710

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440

$12.710

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Microchip USA

USA . 1,194 parts In-Stock

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$24.423

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1,194

$24.423

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Advanced Electronics

New Zealand . 45 parts In-Stock

1+ parts

$28.378

100+ parts

$25.824

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$23.270

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45

$28.378

$25.824

$23.270

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Problanco Electronics

Mexico . 7,554 parts In-Stock

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SupplyDigital Components

Austria . 7,453 parts In-Stock

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TANS Electronics

Latvia . 4,304 parts In-Stock

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Kulean Microsystems

USA . 2,330 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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UHIMA Technologies

Türkiye . 346 parts In-Stock

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Perfect Parts

USA . 320 parts In-Stock

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Overview

Enhance your clock signal integrity with the NB7VQ14MMNHTBG by Onsemi. Designed for precision and reliability, this clock driver & buffer offers seamless input conditioning and ultra-low propagation delay at nominal supply voltage. Ideal for industrial applications, this product boasts a compact square package shape and surface mount design for easy integration. Trust in Onsemi's reputation for quality and innovation to deliver top-notch performance and efficiency. Upgrade your system today with the NB7VQ14MMNHTBG and experience unparalleled value and benefits like never before.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.225 ns

Low propagation delay ensures accurate and efficient clock distribution.

Surface Mount: YES

Surface mount design makes it easy for installation and saves space on the PCB.

Package Shape: SQUARE

Square package shape allows for easy integration into the circuit design.

Nominal Supply Voltage / Vsup (V): 1.8

Compatible with standard supply voltages for hassle-free operation.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating even in extreme cold temperatures.

Terminal Finish: NICKEL GOLD PALLADIUM

High-quality terminal finish ensures reliable connection and longevity.

Minimum Supply Voltage (Vsup): 1.71 V

Supports a wide range of supply voltages for versatile applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand reflow soldering process without damage.

Minimum fmax: 7000 MHz

High maximum frequency allows for fast clock signal transmission.

Technical Specifications

Clock Drivers & Buffers NB7VQ14MMNHTBG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 3.3 AND 2.5 V SUPPLY

Family:

7VQ

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Propagation Delay At Nominal Supply:

.225 ns

Propagation Delay (tpd):

.225 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Minimum fmax:

7000 MHz

Trade Compliance

NB7VQ14MMNHTBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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