Loading...

NB7V32MMNHTBG

Onsemi

NB7V32MMNHTBG by Onsemi

NB7V32MMNHTBG clock driver by Onsemi operates at 1.8/2.5V with a max frequency of 10GHz. It has 16 terminals, is surface mountable, and can withstand industrial temperatures. Ideal for applications requiring high-speed signal buffering in electronic systems.

Median Price

$6.230

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$6.230

1k+ parts

$5.580

10k+ parts

$5.250

4

-

$6.230

$5.580

$5.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,920 parts In-Stock

1+ parts

$6.593

100+ parts

-

1k+ parts

-

10k+ parts

-

1,920

$6.593

-

-

-

Vyrian

USA . 7,073 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,073

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,347 parts In-Stock

1+ parts

$6.246

100+ parts

-

1k+ parts

-

10k+ parts

-

1,347

$6.246

-

-

-

Corohmni

South Africa . 484 parts In-Stock

1+ parts

$6.940

100+ parts

-

1k+ parts

-

10k+ parts

-

484

$6.940

-

-

-

Component Stockers USA

USA . 5 parts In-Stock

1+ parts

$7.060

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$7.060

-

-

-

AZTECH Wire

Italy . 688 parts In-Stock

1+ parts

$21.720

100+ parts

-

1k+ parts

-

10k+ parts

-

688

$21.720

-

-

-

Kulean Microsystems

USA . 8,092 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,092

-

-

-

-

TANS Electronics

Latvia . 3,696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,696

-

-

-

-

UHIMA Technologies

Türkiye . 541 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

541

-

-

-

-

Microchip USA

USA . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

360

-

-

-

-

Perfect Parts

USA . 319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

319

-

-

-

-

SupplyDigital Components

Austria . 291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

291

-

-

-

-

Problanco Electronics

Mexico . 91 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

91

-

-

-

-

Overview

Experience unparalleled performance and reliability with the NB7V32MMNHTBG clock driver & buffer by Onsemi. Crafted with precision and expertise, this high-quality product offers seamless integration and exceptional functionality for a wide range of applications. From telecommunications to data centers, this innovative solution ensures efficient operation and optimal performance. Trust in Onsemi's reputation for excellence and elevate your projects with the NB7V32MMNHTBG clock driver & buffer today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body that ensures long-term functionality.

Surface Mount: YES

Allows for easy installation and space-saving on the PCB.

Power Supplies (V): 1.8/2.5

Compatible with commonly used power supplies, providing flexibility in design.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments, increasing reliability.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions, making it suitable for various applications.

Maximum Frequency At Nominal Supply: 10000000000 Hz

Supports high-frequency operation, ideal for applications requiring precise timing.

Technical Specifications

Clock Drivers & Buffers NB7V32MMNHTBG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N16

Logic IC Type:

Maximum Frequency At Nominal Supply:

10000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5

Maximum Power Supply Current (ICC):

100 mA

Qualification:

Not Qualified

Sub-Category:

Prescaler/Multivibrators

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NB7V32MMNHTBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11