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NB7V33MMNTXG

Onsemi

NB7V33MMNTXG by Onsemi

NB7V33MMNTXG clock driver by Onsemi operates at 1.8/2.5V, with a propagation delay of 0.7ns and max frequency of 10GHz. Ideal for industrial applications, it features differential input conditioning, quad terminals, and a compact square package shape.

Median Price

$30.855

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,401 parts In-Stock

1+ parts

$14.210

100+ parts

$9.643

1k+ parts

$8.821

10k+ parts

$8.581

3,401

$14.210

$9.643

$8.821

$8.581

Chip1Stop

Japan . 406 parts In-Stock

1+ parts

$47.500

100+ parts

$22.500

1k+ parts

-

10k+ parts

-

406

$47.500

$22.500

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 749 parts In-Stock

1+ parts

$6.970

100+ parts

-

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749

$6.970

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Digiode

USA . 1,551 parts In-Stock

1+ parts

$14.592

100+ parts

-

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1,551

$14.592

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,297 parts In-Stock

1+ parts

$13.824

100+ parts

-

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1,297

$13.824

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Corohmni

South Africa . 364 parts In-Stock

1+ parts

$15.360

100+ parts

-

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364

$15.360

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-

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Microchip USA

USA . 4,124 parts In-Stock

1+ parts

$24.656

100+ parts

-

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4,124

$24.656

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Perfect Parts

USA . 10,000 parts In-Stock

1+ parts

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Kulean Microsystems

USA . 7,804 parts In-Stock

1+ parts

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7,804

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Problanco Electronics

Mexico . 7,064 parts In-Stock

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7,064

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SupplyDigital Components

Austria . 2,759 parts In-Stock

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2,759

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Authorized Procurement Solutions

USA . 1,009 parts In-Stock

1+ parts

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1,009

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UHIMA Technologies

Türkiye . 872 parts In-Stock

1+ parts

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872

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TANS Electronics

Latvia . 373 parts In-Stock

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373

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Overview

Enhance the performance of your clock drivers with the NB7V33MMNTXG from Onsemi. Designed with precision and reliability in mind, this product offers unmatched quality and efficiency for your applications. Whether you're looking to improve signal integrity or enhance timing accuracy, this clock driver delivers exceptional results. With its surface mount capability and differential input conditioning, it's a versatile solution for a wide range of electronics projects. Trust Onsemi's reputation for excellence and experience the benefits of this innovative clock driver today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy mounting on a circuit board, making installation and assembly more convenient.

Input Conditioning: DIFFERENTIAL

Provides efficient noise rejection and improved signal integrity, ensuring accurate clock signal transmission.

Package Shape: SQUARE

Square shape design allows for efficient use of space on the circuit board.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage for energy efficiency.

Propagation Delay (tpd): 0.7 ns

Offers fast signal propagation, ensuring timely clock distribution.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with high operating temperature requirements.

Terminal Finish: NICKEL GOLD PALLADIUM

Provides excellent corrosion resistance and ensures high reliability of the product.

Width: 3 mm

Compact size makes it suitable for space-constrained applications.

Maximum Frequency At Nominal Supply: 10000000000 Hz

Can support high-frequency clock signals, making it ideal for demanding applications.

Technical Specifications

Clock Drivers & Buffers NB7V33MMNTXG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT 2.5V SUPPLY

Family:

7V

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

10000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5

Maximum Power Supply Current (ICC):

115 mA

Propagation Delay (tpd):

.7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB7V33MMNTXG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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